Inventor
WANG CHIN-FA
TW9 patents
⚠️ This page may combine multiple inventors who share the name “WANG CHIN-FA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
POWERTECH TECHNOLOGY INC
6 patentsUS7564123B1Jul 21, 2009
Semiconductor package with fastened leads
POWERTECH TECHNOLOGY INC16 citations80
US7884472B2Feb 8, 2011
Semiconductor package having substrate ID code and its fabricating method
POWERTECH TECHNOLOGY INC13 citations79
US7619307B1Nov 17, 2009
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package
POWERTECH TECHNOLOGY INC7 citations70
US8040690B2Oct 18, 2011
Inner-connecting structure of lead frame and its connecting method
POWERTECH TECHNOLOGY INC0 citations49
US7812430B2Oct 12, 2010
Leadframe and semiconductor package having downset baffle paddles
POWERTECH TECHNOLOGY INC0 citations48
US7549568B1Jun 23, 2009
Method of forming identification code for wire-bonding machines
POWERTECH TECHNOLOGY INC1 citations48