Inventor
TOMEKAWA SATORU
JP29 patents
⚠️ This page may combine multiple inventors who share the name “TOMEKAWA SATORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
16 patentsUS6518514B2Feb 11, 2003
Circuit board and production of the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD48 citations96
US7205483B2Apr 17, 2007
Flexible substrate having interlaminar junctions, and process for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD17 citations92
US7184617B2Feb 27, 2007
Portable device
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD29 citations92
US6996902B2Feb 14, 2006
Method for manufacturing a circuit board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD14 citations92
US6774316B1Aug 10, 2004
Wiring board and production method thereof
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD50 citations92
US6691409B2Feb 17, 2004
Method of producing a circuit board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD40 citations92
US6558780B2May 6, 2003
Circuit board and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD24 citations92
US6930395B2Aug 16, 2005
Circuit substrate having improved connection reliability and a method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD13 citations84
US7056571B2Jun 6, 2006
Wiring board and its production process
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD11 citations83
US6596381B2Jul 22, 2003
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations74
US6713688B2Mar 30, 2004
Circuit board and its manufacture method
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations72
US7321496B2Jan 22, 2008
Flexible substrate, multilayer flexible substrate and process for producing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations63
US7103971B2Sep 12, 2006
Process for manufacturing a circuit board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2 citations63
US6686029B2Feb 3, 2004
Circuit board and method for manufacturing the same
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD2 citations63
US7047629B2May 23, 2006
Method of manufacturing circuit board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations61
US6866892B2Mar 15, 2005
Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD0 citations52
PANASONIC CORP
8 patentsUS7799607B2Sep 21, 2010
Process for forming bumps and solder bump
PANASONIC CORP16 citations84
US7773386B2Aug 10, 2010
Flexible substrate, multilayer flexible substrate
PANASONIC CORP13 citations84
US7759162B2Jul 20, 2010
Flip chip mounting process and flip chip assembly
PANASONIC CORP10 citations84
US7969741B2Jun 28, 2011
Substrate structure
PANASONIC CORP11 citations81
US7531754B2May 12, 2009
Flexible substrate having interlaminar junctions, and process for producing the same
PANASONIC CORP6 citations74
US7752749B2Jul 13, 2010
Electronic component mounting method and electronic component mounting device
PANASONIC CORP2 citations62
US8012801B2Sep 6, 2011
Flip chip mounting process and flip chip assembly
PANASONIC CORP1 citations52
US7522938B2Apr 21, 2009
Portable information terminal apparatus
PANASONIC CORP0 citations42
KYOTO ELEX CO LTD
3 patentsUS11739232B2Aug 29, 2023
Conductive paste composition
KYOTO ELEX CO LTD2 citations63
US12552972B2Feb 17, 2026
Conductive adhesive composition
KYOTO ELEX CO LTD0 citations45
US10707360B2Jul 7, 2020
Thermosetting electroconductive paste composition, and solar cell and solar cell module both using the same
KYOTO ELEX CO LTD0 citations42