P

Inventor

DERDERIAN GARO J

US156 patents

Patents

50 patents
US7838084B2Nov 23, 2010

Atomic layer deposition method of depositing an oxide on a substrate

MICRON TECHNOLOGY INC528 citations99
US7589029B2Sep 15, 2009

Atomic layer deposition and conversion

MICRON TECHNOLOGY INC534 citations99
US7431966B2Oct 7, 2008

Atomic layer deposition method of depositing an oxide on a substrate

MICRON TECHNOLOGY INC538 citations99
US6967154B2Nov 22, 2005

Enhanced atomic layer deposition

MICRON TECHNOLOGY INC106 citations99
US6890596B2May 10, 2005

Deposition methods

MICRON TECHNOLOGY INC418 citations99
US6458416B1Oct 1, 2002

Deposition methods

MICRON TECHNOLOGY INC107 citations99
US6420230B1Jul 16, 2002

Capacitor fabrication methods and capacitor constructions

MICRON TECHNOLOGY INC138 citations99
US6355561B1Mar 12, 2002

ALD method to improve surface coverage

MICRON TECHNOLOGY INC335 citations99
US6297527B1Oct 2, 2001

Multilayer electrode for ferroelectric and high dielectric constant capacitors

MICRON TECHNOLOGY INC97 citations99
US6188097B1Feb 13, 2001

Rough electrode (high surface area) from Ti and TiN

MICRON TECHNOLOGY INC90 citations99
US6165834ADec 26, 2000

Method of forming capacitors, method of processing dielectric layers, method of forming a DRAM cell

MICRON TECHNOLOGY INC199 citations99
US7387685B2Jun 17, 2008

Apparatus and method for depositing materials onto microelectronic workpieces

MICRON TECHNOLOGY INC502 citations98
US6844260B2Jan 18, 2005

Insitu post atomic layer deposition destruction of active species

MICRON TECHNOLOGY INC104 citations98
US6627260B2Sep 30, 2003

Deposition methods

MICRON TECHNOLOGY INC77 citations98
US6821347B2Nov 23, 2004

Apparatus and method for depositing materials onto microelectronic workpieces

MICRON TECHNOLOGY INC94 citations97
US6673701B1Jan 6, 2004

Atomic layer deposition methods

MICRON TECHNOLOGY INC223 citations97
US7279732B2Oct 9, 2007

Enhanced atomic layer deposition

MICRON TECHNOLOGY INC58 citations96
US7271077B2Sep 18, 2007

Deposition methods with time spaced and time abutting precursor pulses

MICRON TECHNOLOGY INC82 citations96
US6900497B2May 31, 2005

Integrated circuit with a capacitor comprising an electrode

MICRON TECHNOLOGY INC43 citations96
US6797337B2Sep 28, 2004

Method for delivering precursors

MICRON TECHNOLOGY INC60 citations96
US6780766B2Aug 24, 2004

Methods of forming regions of differing composition over a substrate

MICRON TECHNOLOGY INC46 citations96
US6780758B1Aug 24, 2004

Method of establishing electrical contact between a semiconductor substrate and a semiconductor device

MICRON TECHNOLOGY INC54 citations96
US6777739B2Aug 17, 2004

Multilayer electrode for a ferroelectric capacitor

MICRON TECHNOLOGY INC42 citations96
US6753271B2Jun 22, 2004

Atomic layer deposition methods

MICRON TECHNOLOGY INC40 citations96
US6746916B2Jun 8, 2004

Method for forming a multilayer electrode for a ferroelectric capacitor

MICRON TECHNOLOGY INC48 citations96
US6744093B2Jun 1, 2004

Multilayer electrode for a ferroelectric capacitor

MICRON TECHNOLOGY INC42 citations96
US6617250B2Sep 9, 2003

Methods of depositing a layer comprising tungsten and methods of forming a transistor gate line

MICRON TECHNOLOGY INC38 citations96
US6608343B2Aug 19, 2003

Rough (high surface area) electrode from Ti and TiN, capacitors and semiconductor devices including same

MICRON TECHNOLOGY INC41 citations96
US6596636B2Jul 22, 2003

ALD method to improve surface coverage

MICRON TECHNOLOGY INC66 citations96
US6559472B2May 6, 2003

Film composition

MICRON TECHNOLOGY INC62 citations96
US6511896B2Jan 28, 2003

Method of etching a substantially amorphous TA2O5 comprising layer

MICRON TECHNOLOGY INC48 citations96
US6399982B1Jun 4, 2002

Rough (high surface area) electrode from Ti and TiN capacitors and semiconductor devices including same

MICRON TECHNOLOGY INC54 citations96
US6238994B1May 29, 2001

Method of creating a rough electrode (high surface area) from Ti and TiN and resulting article

MICRON TECHNOLOGY INC47 citations96
US6201276B1Mar 13, 2001

Method of fabricating semiconductor devices utilizing in situ passivation of dielectric thin films

MICRON TECHNOLOGY INC62 citations96
US6156638ADec 5, 2000

Integrated circuitry and method of restricting diffusion from one material to another

MICRON TECHNOLOGY INC53 citations96
US5773363AJun 30, 1998

Semiconductor processing method of making electrical contact to a node

MICRON TECHNOLOGY INC60 citations96
US6451692B1Sep 17, 2002

Preheating of chemical vapor deposition precursors

MICRON TECHNOLOGY INC69 citations95
US7560793B2Jul 14, 2009

Atomic layer deposition and conversion

MICRON TECHNOLOGY INC27 citations93
US7410898B2Aug 12, 2008

Methods of fabricating interconnects for semiconductor components

MICRON TECHNOLOGY INC12 citations93
US7311942B2Dec 25, 2007

Method for binding halide-based contaminants during formation of a titanium-based film

MICRON TECHNOLOGY INC11 citations93
US7279396B2Oct 9, 2007

Methods of forming trench isolation regions with nitride liner

MICRON TECHNOLOGY INC35 citations93
US7164165B2Jan 16, 2007

MIS capacitor

MICRON TECHNOLOGY INC15 citations93
US7071098B2Jul 4, 2006

Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles

MICRON TECHNOLOGY INC20 citations93
US7029985B2Apr 18, 2006

Method of forming MIS capacitor

MICRON TECHNOLOGY INC28 citations93
US6969677B2Nov 29, 2005

Methods of forming conductive metal silicides by reaction of metal with silicon

MICRON TECHNOLOGY INC20 citations93
US6943106B1Sep 13, 2005

Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling

MICRON TECHNOLOGY INC22 citations93
US6861094B2Mar 1, 2005

Methods for forming thin layers of materials on micro-device workpieces

MICRON TECHNOLOGY INC43 citations93
US6818249B2Nov 16, 2004

Reactors, systems with reaction chambers, and methods for depositing materials onto micro-device workpieces

MICRON TECHNOLOGY INC26 citations93
US6787185B2Sep 7, 2004

Deposition methods for improved delivery of metastable species

MICRON TECHNOLOGY INC36 citations93
US6365486B1Apr 2, 2002

Method of fabricating semiconductor devices utilizing in situ passivation of dielectric thin films

MICRON TECHNOLOGY INC16 citations93

Showing the top 50 of 156 patents by PatentIndex Score.