Inventor
SANDHU GURTEJ S
US1,118 patents
⚠️ This page may combine multiple inventors who share the name “SANDHU GURTEJ S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
47 patentsUS8021897B2Sep 20, 2011
Methods of fabricating a cross point memory array
MICRON TECHNOLOGY INC147 citations99
US7199005B2Apr 3, 2007
Methods of forming pluralities of capacitors
MICRON TECHNOLOGY INC129 citations99
US7052972B2May 30, 2006
Method for forming sublithographic features during the manufacture of a semiconductor device and a resulting in-process apparatus
MICRON TECHNOLOGY INC217 citations99
US7026835B2Apr 11, 2006
Engagement probe having a grouping of projecting apexes for engaging a conductive pad
MICRON TECHNOLOGY INC109 citations99
US6939817B2Sep 6, 2005
Removal of carbon from an insulative layer using ozone
MICRON TECHNOLOGY INC526 citations99
US6890596B2May 10, 2005
Deposition methods
MICRON TECHNOLOGY INC418 citations99
US6683005B2Jan 27, 2004
Method of forming capacitor constructions
MICRON TECHNOLOGY INC92 citations99
US6653733B1Nov 25, 2003
Conductors in semiconductor devices
MICRON TECHNOLOGY INC88 citations99
US6573199B2Jun 3, 2003
Methods of treating dielectric materials with oxygen, and methods of forming capacitor constructions
MICRON TECHNOLOGY INC88 citations99
US6524867B2Feb 25, 2003
Method for forming platinum-rhodium stack as an oxygen barrier
MICRON TECHNOLOGY INC121 citations99
US6518610B2Feb 11, 2003
Rhodium-rich oxygen barriers
MICRON TECHNOLOGY INC104 citations99
US6499425B1Dec 31, 2002
Quasi-remote plasma processing method and apparatus
MICRON TECHNOLOGY INC326 citations99
US6458416B1Oct 1, 2002
Deposition methods
MICRON TECHNOLOGY INC107 citations99
US6420230B1Jul 16, 2002
Capacitor fabrication methods and capacitor constructions
MICRON TECHNOLOGY INC138 citations99
US6376284B1Apr 23, 2002
Method of fabricating a memory device
MICRON TECHNOLOGY INC365 citations99
US6369431B1Apr 9, 2002
Method for forming conductors in semiconductor devices
MICRON TECHNOLOGY INC91 citations99
US6338667B2Jan 15, 2002
System for real-time control of semiconductor wafer polishing
MICRON TECHNOLOGY INC101 citations99
US6313035B1Nov 6, 2001
Chemical vapor deposition using organometallic precursors
MICRON TECHNOLOGY INC238 citations99
US6300219B1Oct 9, 2001
Method of forming trench isolation regions
MICRON TECHNOLOGY INC167 citations99
US6281072B1Aug 28, 2001
Multiple step methods for forming conformal layers
MICRON TECHNOLOGY INC227 citations99
US6281142B1Aug 28, 2001
Dielectric cure for reducing oxygen vacancies
MICRON TECHNOLOGY INC124 citations99
US6261151B1Jul 17, 2001
System for real-time control of semiconductor wafer polishing
MICRON TECHNOLOGY INC138 citations99
US6218288B1Apr 17, 2001
Multiple step methods for forming conformal layers
MICRON TECHNOLOGY INC542 citations99
US6188097B1Feb 13, 2001
Rough electrode (high surface area) from Ti and TiN
MICRON TECHNOLOGY INC90 citations99
US6165834ADec 26, 2000
Method of forming capacitors, method of processing dielectric layers, method of forming a DRAM cell
MICRON TECHNOLOGY INC199 citations99
US6025220AFeb 15, 2000
Method of forming a polysilicon diode and devices incorporating such diode
MICRON TECHNOLOGY INC399 citations99
US5955758ASep 21, 1999
Method of forming a capacitor plate and a capacitor incorporating same
MICRON TECHNOLOGY INC123 citations99
US5888906AMar 30, 1999
Plasmaless dry contact cleaning method using interhalogen compounds
MICRON TECHNOLOGY INC292 citations99
US5851135ADec 22, 1998
System for real-time control of semiconductor wafer polishing
MICRON TECHNOLOGY INC238 citations99
US5842909ADec 1, 1998
System for real-time control of semiconductor wafer polishing including heater
MICRON TECHNOLOGY INC98 citations99
US5837564ANov 17, 1998
Method for optimal crystallization to obtain high electrical performance from chalcogenides
MICRON TECHNOLOGY INC385 citations99
US5814852ASep 29, 1998
Method of forming a Ta2 O5 dielectric layer, method of forming a capacitor having a Ta2 O5 dielectric layer, and capacitor construction
MICRON TECHNOLOGY INC95 citations99
US5762537AJun 9, 1998
System for real-time control of semiconductor wafer polishing including heater
MICRON TECHNOLOGY INC133 citations99
US5754390AMay 19, 1998
Integrated capacitor bottom electrode for use with conformal dielectric
MICRON TECHNOLOGY INC392 citations99
US5735960AApr 7, 1998
Apparatus and method to increase gas residence time in a reactor
MICRON TECHNOLOGY INC119 citations99
US5730642AMar 24, 1998
System for real-time control of semiconductor wafer polishing including optical montoring
MICRON TECHNOLOGY INC424 citations99
US5700180ADec 23, 1997
System for real-time control of semiconductor wafer polishing
MICRON TECHNOLOGY INC223 citations99
US5663088ASep 2, 1997
Method of forming a Ta2 O5 dielectric layer with amorphous diffusion barrier layer and method of forming a capacitor having a Ta2 O5 dielectric layer and amorphous diffusion barrier layer
MICRON TECHNOLOGY INC120 citations99
US5658183AAug 19, 1997
System for real-time control of semiconductor wafer polishing including optical monitoring
MICRON TECHNOLOGY INC451 citations99
US5654222AAug 5, 1997
Method for forming a capacitor with electrically interconnected construction
MICRON TECHNOLOGY INC195 citations99
US5643060AJul 1, 1997
System for real-time control of semiconductor wafer polishing including heater
MICRON TECHNOLOGY INC193 citations99
US5641545AJun 24, 1997
Method to deposit highly conformal CVD films
MICRON TECHNOLOGY INC127 citations99
US5618447AApr 8, 1997
Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers
MICRON TECHNOLOGY INC174 citations99
US5523697AJun 4, 1996
Testing apparatus for engaging electrically conductive test pads on a semiconductor substrate having integrated circuitry for operability testing thereof
MICRON TECHNOLOGY INC129 citations99
US5506166AApr 9, 1996
Method for forming capacitor compatible with high dielectric constant materials having a low contact resistance layer
MICRON TECHNOLOGY INC260 citations99
US5486129AJan 23, 1996
System and method for real-time control of semiconductor a wafer polishing, and a polishing head
MICRON TECHNOLOGY INC491 citations99
US5433794AJul 18, 1995
Spacers used to form isolation trenches with improved corners
MICRON TECHNOLOGY INC109 citations99
MICRON SEMICONDUCTOR INC
3 patentsUS5392189AFeb 21, 1995
Capacitor compatible with high dielectric constant materials having two independent insulative layers and the method for forming same
MICRON SEMICONDUCTOR INC334 citations99
US5381302AJan 10, 1995
Capacitor compatible with high dielectric constant materials having a low contact resistance layer and the method for forming same
MICRON SEMICONDUCTOR INC243 citations99
US5377429AJan 3, 1995
Method and appartus for subliming precursors
MICRON SEMICONDUCTOR INC178 citations99
Showing the top 50 of 1,118 patents by PatentIndex Score.