Inventor
WICKRAMANAYAKA SUNIL
JP18 patents
⚠️ This page may combine multiple inventors who share the name “WICKRAMANAYAKA SUNIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ANELVA CORP
6 patentsUS6462482B1Oct 8, 2002
Plasma processing system for sputter deposition applications
ANELVA CORP87 citations97
US7159537B2Jan 9, 2007
Device for fixing a gas showerhead or target plate to an electrode in plasma processing systems
ANELVA CORP54 citations94
US6333601B1Dec 25, 2001
Planar gas introducing unit of a CCP reactor
ANELVA CORP25 citations92
US6225746B1May 1, 2001
Plasma processing system
ANELVA CORP25 citations92
US6216632B1Apr 17, 2001
Plasma processing system
ANELVA CORP32 citations92
US7164571B2Jan 16, 2007
Wafer stage with a magnet
ANELVA CORP5 citations60
CANON ANELVA CORP
6 patentsUS7623334B2Nov 24, 2009
Electrostatic chuck device
CANON ANELVA CORP25 citations92
US7848077B2Dec 7, 2010
Electrostatic chuck device
CANON ANELVA CORP10 citations84
US7791857B2Sep 7, 2010
Electrostatic chuck device
CANON ANELVA CORP7 citations73
US7724493B2May 25, 2010
Electrostatic chuck device
CANON ANELVA CORP5 citations73
US7816283B2Oct 19, 2010
Method of depositing a higher permittivity dielectric film
CANON ANELVA CORP4 citations63
US7625472B2Dec 1, 2009
Plasma-assisted sputter deposition system
CANON ANELVA CORP3 citations62
AGENCY SCIENCE TECH & RES
4 patentsUS10249593B2Apr 2, 2019
Method for bonding a chip to a wafer
AGENCY SCIENCE TECH & RES4 citations67
US9613928B2Apr 4, 2017
Method and apparatus for chip-to-wafer integration
AGENCY SCIENCE TECH & RES0 citations51
US11508619B2Nov 22, 2022
Electrical connection structure and method of forming the same
AGENCY SCIENCE TECH & RES0 citations49
US10134607B2Nov 20, 2018
Method for low temperature bonding of wafers
AGENCY SCIENCE TECH & RES0 citations32