Inventor

TSUJISAWA TAKAFUMI

JP6 patents

⚠️ This page may combine multiple inventors who share the name “TSUJISAWA TAKAFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

3 patents

US6439447B1Aug 27, 2002

Bump joining judging device and method, and semiconductor component production device and method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD23 citations91

US6321973B1Nov 27, 2001

Bump joining method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD8 citations73

US6572005B2Jun 3, 2003

Bump-joining method

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD3 citations62

PANASONIC CORP

2 patents

US7748112B2Jul 6, 2010

Component mounting apparatus and component mounting method

PANASONIC CORP6 citations60

US7552528B2Jun 30, 2009

Wafer expanding device, component feeder, and expanding method for wafer sheet

PANASONIC CORP0 citations39

PANASONIC IP MAN CO LTD

1 patent

US10314177B2Jun 4, 2019

Component mounting method

PANASONIC IP MAN CO LTD0 citations50