Inventor

LANG CHI-I

US98 patents

⚠️ This page may combine multiple inventors who share the name “LANG CHI-I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LANG CHI-I

NOVELLUS SYSTEMS INC

CVD flowable gap fill

Flowable film dielectric gap fill process

CVD flowable gap fill

Flowable film dielectric gap fill process

Pulsed bias having high pulse frequency for filling gaps with dielectric material

Hydrogen treatment enhanced gap fill

Resolving of fluorine loading effect in the vacuum chamber

Flowable film dielectric gap fill process

Stress profile modulation in STI gap fill

H2-based plasma treatment to eliminate within-batch and batch-to-batch etch drift

Helium-based etch process in deposition-etch-deposition gap fill

Strain engineering—HDP thin film with tensile stress for FEOL and other applications

Halogen-free noble gas assisted H2 plasma etch process in deposition-etch-deposition gap fill

INTERMOLECULAR INC

Method and apparatus for high-K gate performance improvement and combinatorial processing

Methods for forming resistive switching memory elements

Methods for forming nonvolatile memory elements with resistive-switching metal oxides

Methods for forming resistive switching memory elements

Methods for forming resistive switching memory elements

Post-CMP cleaning compositions and methods of using same

Method of forming a layer to enhance ALD nucleation on a substrate

Combinatorial processing using a remote plasma source

Substrate processing including a masking layer

Concentrated electroless solution for selective deposition of cobalt-based capping/barrier layers

Combinatorial plasma enhanced deposition and etch techniques

Plasma treatment of low-K surface to improve barrier deposition

Methods for coating a substrate with an amphiphilic compound

APPLIED MATERIALS INC

Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound

CVD plasma assisted lower dielectric constant sicoh film

Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds

Chemical vapor deposition of a copolymer of p-xylylene and a multivinyl silicon/oxygen comonomer

Nano-porous copolymer films having low dielectric constants

Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)

Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide

CVD plasma assisted lower dielectric constant SICOH film

Diamond-like carbon as mandrel

Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)

Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)

Method of depositing a low k dielectric barrier film for copper damascene application

CHIANG TONY P

Vapor based combinatorial processing

Vapor based combinatorial processing

KUMAR NITIN

Methods for forming resistive switching memory elements

Nonvolatile memory elements with metal-deficient resistive-switching metal oxides

LANG CHI-I

CVD flowable gap fill

GAURI VISHAL

Flowable film dielectric gap fill process

SHANKER SUNIL

Combinatorial plasma enhanced deposition and etch techniques

WANG YUN

High throughput current-voltage combinatorial characterization tool and method for combinatorial solar test substrates

CHIANG TONY

Resistive-switching memory element

KALYANKAR NIKHIL D

Combinatorial approach to the development of cleaning formulations for glue removal in semiconductor applications

LEE ALBERT

Plasma processing of metal oxide films for resistive memory device applications

KONG BOB

Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing