Inventor

MIZUKOSHI MASATAKA

JP64 patents

⚠️ This page may combine multiple inventors who share the name “MIZUKOSHI MASATAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MIZUKOSHI MASATAKA

FUJITSU LTD

Semiconductor device and semiconductor device unit for a stack arrangement

Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device

Semiconductor device and a fabrication process thereof

Three-dimensional multi-chip module

Semiconductor device and method of forming the same

Method for fabricating solder bumps by forming solder balls with a solder ball forming member

Method for forming bumps, semiconductor device, and solder paste

Method of manufacturing solder bumps and solder joints using formic acid

IC socket, a test method using the same and an IC socket mounting mechanism

Semiconductor wafer testing method with probe pin contact

Semiconductor device and a fabrication process thereof

Method for forming solder bumps

Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package

Test board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor device

Method for forming bumps, semiconductor device, and solder paste

Interposer and method for manufacturing the same

Plating method, semiconductor device fabrication method and circuit board fabrication method

Interposer and method for fabricating the same

Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system

IC socket, a test method using the same and an IC socket mounting mechanism

Bump-forming method using two plates and electronic device

Method of forming an assembly board with insulator filled through holes

Method for fabricating bump forming plate member

Semiconductor device with reliable electrodes of projecting shape and method of forming same

Semiconductor device and assembly board having through-holes filled with filling core

Semiconductor device having adjacent bonding wires extending at different angles

Electronic device and method for fabricating the same

Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer

Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes

Method for fabricating an interposer

Method for processing a base that includes connecting a first base to a second base with an insulating film

Method of connecting base materials

Method of fabricating semiconductor device and semiconductor device

Pattern forming method

Method for manufacturing capacitor embedded in interposer

Method of manufacturing electronic circuit component

Thin film multi-layer wiring substrate having a coaxial wiring structure in at least one layer

Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same

Semiconductor device and assembly board having through-holes filled with filling core

Semiconductor device and assembly board having through-holes filled with filling core

Semiconductor device and method for manufacturing such

Semiconductor device with reliable electrodes of projecting shape and method of forming same

Semiconductor package and method of manufacturing the same

Method for processing a base that includes connecting a first base to a second base

Method for processing a base that includes connecting a first base to a second base with an insulating film

FUJITSU SEMICONDUCTOR LTD

Semiconductor device suitable for a stacked structure

YOSHIDA EIJI

Semiconductor device suitable for a stacked structure

MIZUKOSHI MASATAKA

Ferroelectric component and manufacturing the same

SHIOGA TAKESHI

Method for manufacturing interposer

ALPHA DESIGN CO LTD

Electronic component bonding method