Inventor
NAKAGAWA KANAE
JP19 patents
⚠️ This page may combine multiple inventors who share the name “NAKAGAWA KANAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
15 patentsUS7863524B2Jan 4, 2011
Interposer and method for manufacturing the same
FUJITSU LTD24 citations92
US7670940B2Mar 2, 2010
Plating method, semiconductor device fabrication method and circuit board fabrication method
FUJITSU LTD26 citations92
US7355290B2Apr 8, 2008
Interposer and method for fabricating the same
FUJITSU LTD20 citations92
US7614142B2Nov 10, 2009
Method for fabricating an interposer
FUJITSU LTD11 citations84
US7247524B2Jul 24, 2007
Manufacturing method of wiring substrate
FUJITSU LTD14 citations83
US6893681B2May 17, 2005
Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same
FUJITSU LTD10 citations73
US10537044B2Jan 14, 2020
Heat dissipating component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing system
FUJITSU LTD1 citations62
US7485962B2Feb 3, 2009
Semiconductor device, wiring substrate forming method, and substrate processing apparatus
FUJITSU LTD4 citations62
US7927998B2Apr 19, 2011
Plating method, semiconductor device fabrication method and circuit board fabrication method
FUJITSU LTD0 citations52
US7704856B2Apr 27, 2010
Semiconductor device, wiring substrate forming method, and substrate processing apparatus
FUJITSU LTD0 citations52
US7648907B2Jan 19, 2010
Semiconductor device, wiring substrate forming method, and substrate processing apparatus
FUJITSU LTD0 citations52
US11709718B2Jul 25, 2023
Barrier synchronization circuit, barrier synchronization method, and parallel information processing apparatus
FUJITSU LTD0 citations51
US11487593B2Nov 1, 2022
Barrier synchronization system and parallel information processing apparatus
FUJITSU LTD0 citations51
US7081304B2Jul 25, 2006
Surface conductive resin, process for forming the same and wiring board
FUJITSU LTD1 citations51
US10777726B2Sep 15, 2020
Thermoelectric conversion module, sensor module, and information processing system
FUJITSU LTD0 citations41
MIZUKOSHI MASATAKA
2 patentsUS8058110B2Nov 15, 2011
Plating method, semiconductor device fabrication method and circuit board fabrication method
MIZUKOSHI MASATAKA0 citations51
US8962470B2Feb 24, 2015
Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
MIZUKOSHI MASATAKA1 citations50