Inventor

FJELSTAD JOSEPH C

US55 patents

⚠️ This page may combine multiple inventors who share the name “FJELSTAD JOSEPH C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FJELSTAD JOSEPH C

INTERCONNECT PORTFOLIO LLC

Multi-surface IC packaging structures and methods for their manufacture

Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity

Interconnect system without through-holes

Torsionally-induced contact-force conductors for electrical connector systems

Signal-segregating connector system

Tapered dielectric and conductor structures and applications thereof

Torsionally-induced contact-force conductors for electrical connector systems

IC package structures having separate circuit interconnection structures and assemblies constructed thereof

High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture

Multi-surface contact IC packaging structures and assemblies

Low profile discrete electronic components and applications of same

Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity

FJELSTAD JOSEPH C

Cabled signaling system and components thereof

Stackable low-profile lead frame package

Flexible circuit assembly without solder

Connector constructions for electronic applications

Connector constructions for electronic applications

Flexible circuit assemblies without solder and methods for their manufacture

Light emitting diode package assembly

Low profile discrete electronic components and applications of same

Electronic assemblies without solder and methods for their manufacture

Monolithic molded flexible electronic assemblies without solder and methods for their manufacture

Multi-surface IC packaging structures

SILICON PIPE INC

Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths

Multi-path via interconnection structures and methods for manufacturing the same

Signal-segregating connector system

High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture

Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity

Multi-surface IC packaging structures and methods for their manufacture

Partitioned integrated circuit package with central clock driver

IC packaging interposer having controlled impedance or optical interconnections and an integral heat spreader

SAMSUNG ELECTRONICS CO LTD

Direct-connect signaling system

Tapered dielectric and conductor structures and applications thereof

High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture

Multi-surface IC packaging structures and methods for their manufacture

Electrical interconnection devices incorporating Fedundant contact points for reducing capacitive stubs and improved signal integrity

TESSERA INC

Connection components with posts

Connection components with posts

Forming conductive posts by selective removal of conductive material

SILICON PIPE

Insulating substrate for IC packages having integral ESD protection

Stair step printed circuit board structures for high speed signal transmissions

SILICONPIPE INC

System for making high-speed connections to board-mounted modules

Array connector with deflectable coupling structure for mating with other components

ELF TECHNOLOGIES INC

Methods and systems of preparing extended length flexible harnesses

WERNER JEREMY

Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween

YASUMURA GARY

Electrical connector with conductors with a ramp to induce torsion

BOEING CO

Methods and apparatus for electrochemically deburring perforate metallic clad dielectric laminates

SAMGSUNG ELECTRONICS CO LTD

Memory IC package assembly having stair step metal layer and apertures

OCCAM PORTFOLIO LLC

Method of making a circuit assembly

GRUNDY KEVIN P

ESD protection utilizing radiated thermal relief