Inventor

TAIN RA-MIN

TW79 patents

⚠️ This page may combine multiple inventors who share the name “TAIN RA-MIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIN RA-MIN

IND TECH RES INST

LED lamp

LED lamp

Flexible circuit board with heat sink

Lighting device with flipped side-structure of LEDs

Light source with LED and optical protrusions

Structure of illuminating unit and structure of illuminating light source

Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels

Ultrasonic atomizing cooling apparatus

Interconnect structure with stress buffering ability and the manufacturing method thereof

Light source module, illuminating apparatus and liquid crystal display

Wafer-to-wafer stack with supporting post

Light emitting diode lighting module with improved heat dissipation structure

Lighting devices

Chip package structure and manufacturing method thereof

Structure for reducing stress for vias and fabricating method thereof

Composite mode transducer and cooling device having the composite mode transducer

High efficiency liquid crystal display projection system

UNIMICRON TECHNOLOGY CORP

Circuit carrier board structure and manufacturing method thereof

Circuit board structure

Circuit carrier and manufacturing method thereof and package structure

Chip package structure

Package structure with structure reinforcing element and manufacturing method thereof

Circuit board and manufacturing method thereof

Manufacturing method of interconnection structure

Interconnection structure and manufacturing method thereof

Probe card testing device

Method for manufacturing an interposer, interposer and chip package structure

Manufacturing method of circuit carrier board structure

Package structure with structure reinforcing element and manufacturing method thereof

Package structure with structure reinforcing element and manufacturing method thereof

Embedded chip package, manufacturing method thereof, and package-on-package structure

Method for forming circuit board stacked structure

Circuit board structure

Electronic packaging structure and manufacturing method thereof

TAIN RA-MIN

Heat dissipation structure for electronic device and fabrication method thereof

Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor

Heat-pipe electric-power generating device

Heat dissipation structure for electronic device and fabrication method thereof

Heat-pipe electric power generating device and hydrogen/oxygen gas generating apparatus and internal combustion engine system having the same

CHANG CHI-SHIH

Wafer-to-wafer stack with supporting pedestal

Wafer-to-wafer stack with supporting pedestal

HSIEH MING-CHE

Chip package structure and method for fabricating the same

LIU CHUN-KAI

Semiconductor device

DAI MING-JI

Filled through-silicon via with conductive composite material

Chen yao shun

Hermetic light-emitting device

IND TECHNOLOGY RES INSTITURE

Apparatus and method for measuring diode chip

WANG KUNG-HSIA

Light emitting devices having heat-dissipating surface

CHEN YAO-SHUN

Heat-pipe electric power generating device and hydrogen/oxygen gas generating apparatus and internal combustion engine system having the same

WU SHENG-TSAI

Chip stacking structure and fabricating method of the chip stacking structure

YU CHIH-KUANG

Package structures for integrating thermoelectric components with stacking chips