Inventor

HOSOKAWA KOJI

JP14 patents

⚠️ This page may combine multiple inventors who share the name “HOSOKAWA KOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

4 patents

US10431556B2Oct 1, 2019

Semiconductor device including semiconductor chips mounted over both surfaces of substrate

MICRON TECHNOLOGY INC3 citations71

US9418968B2Aug 16, 2016

Semiconductor device including semiconductor chips mounted over both surfaces of substrate

MICRON TECHNOLOGY INC3 citations71

US9799611B2Oct 24, 2017

Semiconductor device including semiconductor chips mounted over both surfaces of substrate

MICRON TECHNOLOGY INC1 citations50

US9748204B2Aug 29, 2017

Semiconductor device including semiconductor chips stacked over substrate

MICRON TECHNOLOGY INC1 citations50

ELPIDA MEMORY INC

2 patents

US7633147B2Dec 15, 2009

Semiconductor unit having two device terminals for every one input/output signal

ELPIDA MEMORY INC60 citations97

US7659623B2Feb 9, 2010

Semiconductor device having improved wiring

ELPIDA MEMORY INC5 citations62

WATANABE YUJI

2 patents

US8164186B2Apr 24, 2012

BGA semiconductor device having a dummy bump

WATANABE YUJI8 citations82

US8222737B2Jul 17, 2012

BGA semiconductor device having a dummy bump

WATANABE YUJI4 citations61

IBM

1 patent

US5732042AMar 24, 1998

Dram array with local latches

IBM30 citations92

TOSHIBA KK

1 patent

US7046475B2May 16, 2006

Apparatus and method for controlling head unload operation in disk drive

TOSHIBA KK31 citations91

HOSOKAWA KOJI

1 patent

US8873247B2Oct 28, 2014

Device and manufacturing method of the same

HOSOKAWA KOJI5 citations66

KYODO YUSHI

1 patent

US9574159B2Feb 21, 2017

Grease composition for image forming apparatus and image forming apparatus with grease composition

KYODO YUSHI1 citations52

TOSHIBA TEC KK

1 patent

US11847238B2Dec 19, 2023

Image reading apparatus and method of transmitting scan data including password-protectable scan data

TOSHIBA TEC KK0 citations51

HITACHI LTD

1 patent

US7573128B2Aug 11, 2009

Semiconductor module in which a semiconductor package is bonded on a mount substrate

HITACHI LTD0 citations40