Inventor
ANJO ICHIRO
JP43 patents
⚠️ This page may combine multiple inventors who share the name “ANJO ICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
24 patentsUS5068712ANov 26, 1991
Semiconductor device
HITACHI LTD165 citations99
US6627997B1Sep 30, 2003
Semiconductor module and method of mounting
HITACHI LTD124 citations98
US6621154B1Sep 16, 2003
Semiconductor apparatus having stress cushioning layer
HITACHI LTD65 citations96
US6404049B1Jun 11, 2002
Semiconductor device, manufacturing method thereof and mounting board
HITACHI LTD59 citations96
US6784541B2Aug 31, 2004
Semiconductor module and mounting method for same
HITACHI LTD37 citations93
US6100580AAug 8, 2000
Semiconductor device having all outer leads extending from one side of a resin member
HITACHI LTD17 citations93
US7057283B2Jun 6, 2006
Semiconductor device and method for producing the same
HITACHI LTD26 citations92
US6624504B1Sep 23, 2003
Semiconductor device and method for manufacturing the same
HITACHI LTD43 citations92
US6515371B2Feb 4, 2003
Semiconductor device with elastic structure and wiring
HITACHI LTD13 citations92
US6348741B1Feb 19, 2002
Semiconductor apparatus and a manufacturing method thereof
HITACHI LTD25 citations92
US6307269B1Oct 23, 2001
Semiconductor device with chip size package
HITACHI LTD32 citations92
US6621160B2Sep 16, 2003
Semiconductor device and mounting board
HITACHI LTD13 citations84
US7546506B2Jun 9, 2009
DRAM stacked package, DIMM, and semiconductor manufacturing method
HITACHI LTD15 citations83
US6326681B1Dec 4, 2001
Semiconductor device
HITACHI LTD14 citations82
US6303982B2Oct 16, 2001
Semiconductor device
HITACHI LTD10 citations82
US6069029AMay 30, 2000
Semiconductor device chip on lead and lead on chip manufacturing
HITACHI LTD13 citations82
US5863817AJan 26, 1999
Semiconductor device
HITACHI LTD7 citations82
US5821606AOct 13, 1998
Semiconductor device
HITACHI LTD9 citations82
US6563212B2May 13, 2003
Semiconductor device
HITACHI LTD12 citations74
US6124629ASep 26, 2000
Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip
HITACHI LTD3 citations74
US6639323B2Oct 28, 2003
Semiconductor device and its manufacturing method
HITACHI LTD6 citations73
US6100115AAug 8, 2000
Semiconductor device
HITACHI LTD1 citations63
US4974054ANov 27, 1990
Resin molded semiconductor device
HITACHI LTD6 citations63
US6204552B1Mar 20, 2001
Semiconductor device
HITACHI LTD0 citations52
RENESAS TECH CORP
13 patentsUS6861742B2Mar 1, 2005
Wafer level chip size package having rerouting layers
RENESAS TECH CORP64 citations96
US6940162B2Sep 6, 2005
Semiconductor module and mounting method for same
RENESAS TECH CORP23 citations93
US6720591B2Apr 13, 2004
Semiconductor integrated circuit device
RENESAS TECH CORP16 citations93
US6989600B2Jan 24, 2006
Integrated circuit device having reduced substrate size and a method for manufacturing the same
RENESAS TECH CORP45 citations92
US6930388B2Aug 16, 2005
Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure
RENESAS TECH CORP37 citations92
US6822317B1Nov 23, 2004
Semiconductor apparatus including insulating layer having a protrusive portion
RENESAS TECH CORP37 citations92
US6770547B1Aug 3, 2004
Method for producing a semiconductor device
RENESAS TECH CORP40 citations92
US6946723B2Sep 20, 2005
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP13 citations84
US6949416B2Sep 27, 2005
Method of manufacturing a semiconductor integrated circuit device
RENESAS TECH CORP9 citations74
US6720208B2Apr 13, 2004
Semiconductor device
RENESAS TECH CORP2 citations74
US6946327B2Sep 20, 2005
Semiconductor device and manufacturing method of that
RENESAS TECH CORP2 citations63
US7378333B2May 27, 2008
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP0 citations52
US6919622B2Jul 19, 2005
Semiconductor device
RENESAS TECH CORP0 citations52