Inventor

HSIEH TSUNG-LIN

TW4 patents

⚠️ This page may combine multiple inventors who share the name “HSIEH TSUNG-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

2 patents

US12358783B2Jul 15, 2025

Wire-bond damper for shock absorption

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60

US11987494B2May 21, 2024

Wire-bond damper for shock absorption

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60

CHI MEI COMM SYSTEMS INC

1 patent

US8013796B2Sep 6, 2011

Dual-band antenna

CHI MEI COMM SYSTEMS INC7 citations79

LIU HSIN-HUNG

1 patent

US8270182B2Sep 18, 2012

Mobile phone with metal hinged shield

LIU HSIN-HUNG0 citations42