Inventor
ALTMAN LEONARD F
US6 patents
Patents
6 patentsUS5024372AJun 18, 1991
Method of making high density solder bumps and a substrate socket for high density solder bumps
MOTOROLA INC221 citations97
US5055816AOct 8, 1991
Method for fabricating an electronic device
MOTOROLA INC106 citations95
US4827326AMay 2, 1989
Integrated circuit having polyimide/metal passivation layer and method of manufacture using metal lift-off
MOTOROLA INC37 citations91
US4948941AAug 14, 1990
Method of laser drilling a substrate
MOTOROLA INC39 citations86
US5091218AFeb 25, 1992
Method for producing a metallized pattern on a substrate
MOTOROLA INC5 citations62
US5198264AMar 30, 1993
Method for adhering polyimide to a substrate
MOTOROLA INC5 citations61