P

Inventor

MAO SEN

TW14 patents
⚠️ This page may combine multiple inventors who share the name “MAO SEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VISHAY SILICONIX

3 patents
US9589929B2Mar 7, 2017

Method for fabricating stack die package

VISHAY SILICONIX28 citations94
US9966330B2May 8, 2018

Stack die package

VISHAY SILICONIX8 citations84
US10546840B2Jan 28, 2020

Method for fabricating stack die package

VISHAY SILICONIX4 citations73

OWYANG KING

3 patents
US8471381B2Jun 25, 2013

Complete power management system implemented in a single surface mount package

OWYANG KING13 citations90
US9093359B2Jul 28, 2015

Complete power management system implemented in a single surface mount package

OWYANG KING1 citations60
US8928138B2Jan 6, 2015

Complete power management system implemented in a single surface mount package

OWYANG KING3 citations60

TAIWAN SEMICONDUCTOR CO LTD

3 patents
US9997500B1Jun 12, 2018

Common-source packaging structure

TAIWAN SEMICONDUCTOR CO LTD2 citations71
US10056355B2Aug 21, 2018

Common-source packaging structure

TAIWAN SEMICONDUCTOR CO LTD0 citations50
US10090298B2Oct 2, 2018

Integrated packaging structure

TAIWAN SEMICONDUCTOR CO LTD0 citations40

SILICONIX INC

2 patents
US7394150B2Jul 1, 2008

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

SILICONIX INC35 citations91
US7238551B2Jul 3, 2007

Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys

SILICONIX INC37 citations91

JAUNAY SERGE

1 patent
US8586419B2Nov 19, 2013

Semiconductor packages including die and L-shaped lead and method of manufacture

JAUNAY SERGE9 citations76

SILICONIX TAIWAN LTD

1 patent
US6744119B2Jun 1, 2004

Leadframe having slots in a die pad

SILICONIX TAIWAN LTD11 citations69

SILICONX TAIWAN LTD

1 patent
US6414362B1Jul 2, 2002

Power semiconductor device

SILICONX TAIWAN LTD1 citations48