Inventor

HIEW PEY FANG

MY2 patents

⚠️ This page may combine multiple inventors who share the name “HIEW PEY FANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NXP BV

1 patent

US12588538B2Mar 24, 2026

Semiconductor device having wired under bump structure and method therefor

NXP BV0 citations56

AU YIN KHENG

1 patent

US8853840B2Oct 7, 2014

Semiconductor package with inner and outer leads

AU YIN KHENG3 citations47