Inventor

YERUVA SURESH B

US2 patents

⚠️ This page may combine multiple inventors who share the name “YERUVA SURESH B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHENG TIEYU

1 patent

US8952532B2Feb 10, 2015

Integrated circuit package with spatially varied solder resist opening dimension

ZHENG TIEYU7 citations77

INTEL CORP

1 patent

US9312237B2Apr 12, 2016

Integrated circuit package with spatially varied solder resist opening dimension

INTEL CORP2 citations58