Inventor

BERA KALLOL

US79 patents

⚠️ This page may combine multiple inventors who share the name “BERA KALLOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BERA KALLOL

APPLIED MATERIALS INC

Plasma reactor with a multiple zone thermal control feed forward control apparatus

Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity

Method for agile workpiece temperature control in a plasma reactor using a thermal model

RF multi-feed structure to improve plasma uniformity

RF multi-feed structure to improve plasma uniformity

Plasma reactor with reduced electrical skew using electrical bypass elements

Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor

Plasma processing apparatus

Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources

Methods and apparatus for controlling characteristics of a plasma

Apparatus and method to confine plasma and reduce flow resistance in a plasma

Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor

Plasma etch process using polymerizing etch gases across a wafer surface and additional polymer managing or controlling gases in independently fed gas zones with time and spatial modulation of gas content

Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones

Plasma etch process using polymerizing etch gases with different etch and polymer-deposition rates in different radial gas injection zones with time modulation

Symmetric plasma source to generate pie shaped treatment

Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor

Method of operating a capacitively coupled plasma reactor with dual temperature control loops

Apparatus to confine plasma and to enhance flow conductance

Multi-substrate thermal management apparatus

Showerhead with interlaced gas feed and removal and methods of use

Plasma reactor with electrode array in ceiling

Plasma source for rotating susceptor

Shaped electrodes for improved plasma exposure from vertical plasma source

Contour pocket and hybrid susceptor for wafer uniformity

Processing tool with electrically switched electrode assembly

Method and apparatus to confine plasma and to enhance flow conductance

Modular high-frequency source

BUCHBERGER JR DOUGLAS A

Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes

Method of processing a workpiece in a plasma reactor using feed forward thermal control

Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loops

Capacitively coupled plasma reactor having very agile wafer temperature control

Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes

Capacitively coupled plasma reactor having very agile wafer temperature control

BERA KALLOL

Plasma reactor gas distribution plate with radially distributed path splitting manifold

Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone

Apparatus for controlling gas flow in a semiconductor substrate processing chamber

Apparatus for controlling the temperature uniformity of a substrate

BRILLHART PAUL LUKAS

Plasma reactor with a multiple zone thermal control feed forward control apparatus

Method of processing a workpiece in a plasma reactor using multiple zone feed forward thermal control

Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution

Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor

CARDUCCI JAMES D

Temperature controlled chamber liner

Etching chamber having flow equalizer and lower liner

COLLINS KENNETH S

Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes

Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator

LUBOMIRSKY DMITRY

Gas distribution plate with discrete protective elements

MAHADESWARASWAMY CHETAN

Temperature controlled plasma processing chamber component with zone dependent thermal efficiencies

HOFFMAN DANIEL J

Annular baffle

TAVASSOLI HAMID

Multi-zoned plasma processing electrostatic chuck with improved temperature uniformity