Inventor
BEAL SAM
US3 patents
Patents
3 patentsUS6175161B1Jan 16, 2001
System and method for packaging integrated circuits
ALPINE MICROSYSTEMS INC108 citations95
US6436735B1Aug 20, 2002
Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact
ALPINE MICROSYSTEMS INC16 citations90
US6128201AOct 3, 2000
Three dimensional mounting assembly for integrated circuits
ALPINE MICROSYSTEMS INC47 citations89