Inventor
KANG SUNG KWON
US32 patents
⚠️ This page may combine multiple inventors who share the name “KANG SUNG KWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
26 patentsUS6600224B1Jul 29, 2003
Thin film attachment to laminate using a dendritic interconnection
IBM83 citations98
US6337522B1Jan 8, 2002
Structure employing electrically conductive adhesives
IBM114 citations98
US6238599B1May 29, 2001
High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications
IBM90 citations98
US6224690B1May 1, 2001
Flip-Chip interconnections using lead-free solders
IBM191 citations98
US6114413ASep 5, 2000
Thermally conducting materials and applications for microelectronic packaging
IBM149 citations98
US5937320AAug 10, 1999
Barrier layers for electroplated SnPb eutectic solder joints
IBM297 citations98
US5958590ASep 28, 1999
Dendritic powder materials for high conductivity paste applications
IBM72 citations96
US5837119ANov 17, 1998
Methods of fabricating dendritic powder materials for high conductivity paste applications
IBM60 citations96
US6297559B1Oct 2, 2001
Structure, materials, and applications of ball grid array interconnections
IBM55 citations95
US6879098B2Apr 12, 2005
Display fabrication using modular active devices
IBM24 citations93
US6698077B2Mar 2, 2004
Display fabrication using modular active devices
IBM39 citations93
US6646355B2Nov 11, 2003
Structure comprising beam leads bonded with electrically conductive adhesive
IBM20 citations93
US6322685B1Nov 27, 2001
Apparatus and method for plating coatings on to fine powder materials and use of the powder therefrom
IBM32 citations93
US6784088B2Aug 31, 2004
Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
IBM16 citations92
US6555762B2Apr 29, 2003
Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition
IBM38 citations92
US6551931B1Apr 22, 2003
Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
IBM27 citations92
US6300164B1Oct 9, 2001
Structure, materials, and methods for socketable ball grid
IBM42 citations91
US6120885ASep 19, 2000
Structure, materials, and methods for socketable ball grid
IBM25 citations91
US6059952AMay 9, 2000
Method of fabricating coated powder materials and their use for high conductivity paste applications
IBM51 citations89
US5855993AJan 5, 1999
Electronic devices having metallurgies containing copper-semiconductor compounds
IBM49 citations89
US7273803B2Sep 25, 2007
Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
IBM16 citations82
US6632314B1Oct 14, 2003
Method of making a lamination and surface planarization for multilayer thin film interconnect
IBM14 citations82
US6258703B1Jul 10, 2001
Reflow of low melt solder tip C4's
IBM8 citations74
US7467742B1Dec 23, 2008
Electrically conducting adhesives for via fill applications
IBM2 citations63
US7115996B2Oct 3, 2006
Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped
IBM3 citations63
US7932169B2Apr 26, 2011
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers
IBM1 citations51
KANG SUNG KWON
2 patentsUS8691685B2Apr 8, 2014
Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
KANG SUNG KWON0 citations47
US8679964B2Mar 25, 2014
Prevention and control of intermetallic alloy inclusions
KANG SUNG KWON0 citations47