Inventor

LU JIONGXIN

US3 patents

⚠️ This page may combine multiple inventors who share the name “LU JIONGXIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLE INC

2 patents

US12469765B2Nov 11, 2025

Thermally enhanced chip-on-wafer or wafer-on-wafer bonding

APPLE INC0 citations59

US11404337B2Aug 2, 2022

Scalable extreme large size substrate integration

APPLE INC0 citations59

INTEL CORP

1 patent

US11916003B2Feb 27, 2024

Varied ball ball-grid-array (BGA) packages

INTEL CORP0 citations58