Inventor

LEIFESTE HEATHER D

US4 patents

⚠️ This page may combine multiple inventors who share the name “LEIFESTE HEATHER D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RAYTHEON CO

3 patents

USD911986SMar 2, 2021

HAMPP ANDREAS

1 patent

US8154099B2Apr 10, 2012

Composite semiconductor structure formed using atomic bonding and adapted to alter the rate of thermal expansion of a substrate

HAMPP ANDREAS7 citations73

LEIFESTE HEATHER D

RAYTHEON CO

Handheld semiconductor wafer handling tool

Eliminating interconnect strains in microcircuits

Paddle tool for transporting semiconductor wafers or other components

HAMPP ANDREAS

Composite semiconductor structure formed using atomic bonding and adapted to alter the rate of thermal expansion of a substrate