Inventor
TAKAMOTO NAOHIDE
JP48 patents
⚠️ This page may combine multiple inventors who share the name “TAKAMOTO NAOHIDE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
22 patentsUSD589473SMar 31, 2009
Adhesive film material for use in manufacturing semiconductors
NITTO DENKO CORP23 citations92
US9768050B2Sep 19, 2017
Film for semiconductor back surface and its use
NITTO DENKO CORP2 citations72
US10014235B2Jul 3, 2018
Underfill material, laminated sheet and method for producing semiconductor device
NITTO DENKO CORP3 citations71
US7611926B2Nov 3, 2009
Thermosetting die bonding film
NITTO DENKO CORP6 citations71
US8766462B2Jul 1, 2014
Dicing tape-integrated wafer back surface protective film
NITTO DENKO CORP2 citations63
US8648476B2Feb 11, 2014
Dicing tape-integrated wafer back surface protective film
NITTO DENKO CORP3 citations63
US7829441B2Nov 9, 2010
Thermosetting die-bonding film
NITTO DENKO CORP5 citations63
US9478454B2Oct 25, 2016
Dicing tape-integrated film for semiconductor back surface
NITTO DENKO CORP2 citations61
US9085685B2Jul 21, 2015
Under-fill material and method for producing semiconductor device
NITTO DENKO CORP2 citations60
US10211083B2Feb 19, 2019
Film for flip chip type semiconductor back surface and its use
NITTO DENKO CORP0 citations52
US9761475B2Sep 12, 2017
Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
NITTO DENKO CORP1 citations52
US9620403B2Apr 11, 2017
Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor device
NITTO DENKO CORP0 citations52
US9362156B2Jun 7, 2016
Dicing tape-integrated film for semiconductor back surface
NITTO DENKO CORP0 citations52
US9324616B2Apr 26, 2016
Method of manufacturing flip-chip type semiconductor device
NITTO DENKO CORP1 citations52
US9279064B2Mar 8, 2016
Manufacturing semiconductor device with film for forming protective layer
NITTO DENKO CORP1 citations52
US9050773B2Jun 9, 2015
Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
NITTO DENKO CORP0 citations52
US8841780B2Sep 23, 2014
Dicing tape-integrated wafer back surface protective film
NITTO DENKO CORP0 citations52
US8912665B2Dec 16, 2014
Dicing tape-integrated film for semiconductor back surface
NITTO DENKO CORP0 citations51
US9679797B2Jun 13, 2017
Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device
NITTO DENKO CORP1 citations50
US9472439B2Oct 18, 2016
Reinforcing sheet and method for producing secondary mounted semiconductor device
NITTO DENKO CORP1 citations50
US9368421B2Jun 14, 2016
Under-fill material and method for producing semiconductor device
NITTO DENKO CORP0 citations50
US10141217B2Nov 27, 2018
Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device
NITTO DENKO CORP0 citations40
TAKAMOTO NAOHIDE
15 patentsUS8986486B2Mar 24, 2015
Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
TAKAMOTO NAOHIDE8 citations83
US8722517B2May 13, 2014
Dicing tape-integrated film for semiconductor back surface
TAKAMOTO NAOHIDE7 citations82
US8237294B2Aug 7, 2012
Dicing tape-integrated wafer back surface protective film
TAKAMOTO NAOHIDE4 citations74
US8643194B2Feb 4, 2014
Dicing tape-integrated film for semiconductor back surface
TAKAMOTO NAOHIDE4 citations72
US8513816B2Aug 20, 2013
Film for flip chip type semiconductor back surface containing thermoconductive filler
TAKAMOTO NAOHIDE5 citations72
US8558397B2Oct 15, 2013
Dicing tape-integrated wafer back surface protective film
TAKAMOTO NAOHIDE1 citations63
US9074113B2Jul 7, 2015
Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
TAKAMOTO NAOHIDE2 citations62
US8692389B2Apr 8, 2014
Dicing tape-integrated film for semiconductor back surface
TAKAMOTO NAOHIDE3 citations62
US8652938B2Feb 18, 2014
Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device
TAKAMOTO NAOHIDE2 citations62
US8492907B2Jul 23, 2013
Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
TAKAMOTO NAOHIDE3 citations62
US8420509B2Apr 16, 2013
Film for flip chip type semiconductor back surface
TAKAMOTO NAOHIDE2 citations62
US9035466B2May 19, 2015
Dicing tape-integrated film for semiconductor back surface
TAKAMOTO NAOHIDE0 citations52
US8704382B2Apr 22, 2014
Film for flip chip type semiconductor back surface
TAKAMOTO NAOHIDE1 citations52
US9911683B2Mar 6, 2018
Film for back surface of flip-chip semiconductor
TAKAMOTO NAOHIDE0 citations51
US9196533B2Nov 24, 2015
Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device
TAKAMOTO NAOHIDE0 citations41
ODA TAKASHI
3 patentsUS9202795B2Dec 1, 2015
Laminated film and use thereof
ODA TAKASHI2 citations60
US8518745B2Aug 27, 2013
Method of manufacturing semiconductor device having a bumped wafer and protective layer
ODA TAKASHI0 citations52
US8420510B2Apr 16, 2013
Method of manufacturing semiconductor device
ODA TAKASHI0 citations50
SHIGA GOJI
3 patentsUS8450189B2May 28, 2013
Film for flip chip type semiconductor back surface
SHIGA GOJI2 citations60
US8455302B2Jun 4, 2013
Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
SHIGA GOJI0 citations49
US8404522B2Mar 26, 2013
Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
SHIGA GOJI0 citations49