Inventor
SHIGA GOJI
JP30 patents
⚠️ This page may combine multiple inventors who share the name “SHIGA GOJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAKAMOTO NAOHIDE
13 patentsUS8986486B2Mar 24, 2015
Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
TAKAMOTO NAOHIDE8 citations83
US8722517B2May 13, 2014
Dicing tape-integrated film for semiconductor back surface
TAKAMOTO NAOHIDE7 citations82
US8643194B2Feb 4, 2014
Dicing tape-integrated film for semiconductor back surface
TAKAMOTO NAOHIDE4 citations72
US8513816B2Aug 20, 2013
Film for flip chip type semiconductor back surface containing thermoconductive filler
TAKAMOTO NAOHIDE5 citations72
US9074113B2Jul 7, 2015
Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
TAKAMOTO NAOHIDE2 citations62
US8692389B2Apr 8, 2014
Dicing tape-integrated film for semiconductor back surface
TAKAMOTO NAOHIDE3 citations62
US8652938B2Feb 18, 2014
Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device
TAKAMOTO NAOHIDE2 citations62
US8492907B2Jul 23, 2013
Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
TAKAMOTO NAOHIDE3 citations62
US8420509B2Apr 16, 2013
Film for flip chip type semiconductor back surface
TAKAMOTO NAOHIDE2 citations62
US9035466B2May 19, 2015
Dicing tape-integrated film for semiconductor back surface
TAKAMOTO NAOHIDE0 citations52
US8704382B2Apr 22, 2014
Film for flip chip type semiconductor back surface
TAKAMOTO NAOHIDE1 citations52
US9911683B2Mar 6, 2018
Film for back surface of flip-chip semiconductor
TAKAMOTO NAOHIDE0 citations51
US9196533B2Nov 24, 2015
Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device
TAKAMOTO NAOHIDE0 citations41
NITTO DENKO CORP
12 patentsUS9754894B2Sep 5, 2017
Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing
NITTO DENKO CORP2 citations71
US9659883B2May 23, 2017
Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package
NITTO DENKO CORP2 citations70
US9478454B2Oct 25, 2016
Dicing tape-integrated film for semiconductor back surface
NITTO DENKO CORP2 citations61
US10211083B2Feb 19, 2019
Film for flip chip type semiconductor back surface and its use
NITTO DENKO CORP0 citations52
US9761475B2Sep 12, 2017
Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
NITTO DENKO CORP1 citations52
US9620403B2Apr 11, 2017
Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor device
NITTO DENKO CORP0 citations52
US9362156B2Jun 7, 2016
Dicing tape-integrated film for semiconductor back surface
NITTO DENKO CORP0 citations52
US9324616B2Apr 26, 2016
Method of manufacturing flip-chip type semiconductor device
NITTO DENKO CORP1 citations52
US9050773B2Jun 9, 2015
Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
NITTO DENKO CORP0 citations52
US10297470B2May 21, 2019
Resin sheet for sealing electronic device and method for manufacturing electronic-device package
NITTO DENKO CORP0 citations50
US10128131B2Nov 13, 2018
Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor device
NITTO DENKO CORP0 citations48
US10074582B2Sep 11, 2018
Sealing sheet
NITTO DENKO CORP0 citations39
SHIGA GOJI
3 patentsUS8450189B2May 28, 2013
Film for flip chip type semiconductor back surface
SHIGA GOJI2 citations60
US8455302B2Jun 4, 2013
Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
SHIGA GOJI0 citations49
US8404522B2Mar 26, 2013
Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
SHIGA GOJI0 citations49