Inventor

ASAI FUMITERU

JP29 patents

⚠️ This page may combine multiple inventors who share the name “ASAI FUMITERU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ASAI FUMITERU

NITTO DENKO CORP

Anisotropic conductive film

Semiconductor wafer with anisotropic conductor film, and method of manufacture thereof

Pressure-sensitive adhesive sheet and process for producing semiconductor device having same

Production method of anisotropic conductive film and anisotropic conductive film produced by this method

Method of manufacturing an anisotropic conductive film

Battery containing a polycarbodiimide polymer

Dicing tape-integrated film for semiconductor back surface

Adhesive sheet for processing semiconductor substrates

Pressure-sensitive adhesive sheet for processing semiconductor wafer or semiconductor substrate

Film for flip chip type semiconductor back surface and its use

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

Method of manufacturing flip-chip type semiconductor device

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

TAKAMOTO NAOHIDE

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

Dicing tape-integrated film for semiconductor back surface

Dicing tape-integrated film for semiconductor back surface

Film for flip chip type semiconductor back surface containing thermoconductive filler

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

SHIGA GOJI

Film for flip chip type semiconductor back surface

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

HABU TAKASHI

Pressure-sensitive adhesive sheet for protecting semiconductor wafer

Substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, method for grinding back side of semiconductor wafer using pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive sheet

MURATA SHUHEI

Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chip

ASAI FUMITERU

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

TERADA YOSHIO

Pressure-sensitive adhesive sheet for testing

KOMOTO YUSUKE

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device