P

Inventor

OKADA TORU

JP68 patents
⚠️ This page may combine multiple inventors who share the name “OKADA TORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUJITSU LTD

19 patents
US6483190B1Nov 19, 2002

Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method

FUJITSU LTD29 citations93
US6400529B1Jun 4, 2002

Integrated circuit chip supporting and electrically connecting a head slider

FUJITSU LTD28 citations93
US6885522B1Apr 26, 2005

Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation

FUJITSU LTD17 citations92
US6653761B2Nov 25, 2003

Micro-actuator and method of producing the same

FUJITSU LTD22 citations92
US6903876B2Jun 7, 2005

Display

FUJITSU LTD37 citations91
US5560534AOct 1, 1996

Soldering apparatus

FUJITSU LTD20 citations90
US7347347B2Mar 25, 2008

Head assembly, disk unit, and bonding method and apparatus

FUJITSU LTD15 citations84
US6541898B2Apr 1, 2003

Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method

FUJITSU LTD14 citations83
US7133733B2Nov 7, 2006

Design support system

FUJITSU LTD15 citations82
US7111390B2Sep 26, 2006

Parts mounting and assembling apparatus

FUJITSU LTD16 citations82
US7436062B2Oct 14, 2008

Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method

FUJITSU LTD6 citations74
US6848154B2Feb 1, 2005

Method of producing a micro-actuator

FUJITSU LTD8 citations73
US6467141B2Oct 22, 2002

Method of assembling micro-actuator

FUJITSU LTD12 citations73
US7753251B2Jul 13, 2010

Micro component removing apparatus

FUJITSU LTD2 citations62
US7717317B2May 18, 2010

Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing method

FUJITSU LTD2 citations62
US6744183B2Jun 1, 2004

Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method

FUJITSU LTD2 citations62
US7963434B2Jun 21, 2011

Micro component removing method

FUJITSU LTD0 citations52
US7748594B2Jul 6, 2010

Solder repairing apparatus and method of repairing solder

FUJITSU LTD0 citations52
US7691662B2Apr 6, 2010

Optical module producing method and apparatus

FUJITSU LTD1 citations52

CANON DENSHI KK

6 patents

KOBE STEEL LTD

5 patents

OKADA TORU

5 patents

CANON KK

3 patents

(unassigned)

2 patents

PANASONIC IP MAN CO LTD

2 patents

MITSUBISHI MOTORS CORP

1 patent

COMPAQ COMPUTER CORP

1 patent

KUNIEDA SHIGETOSHI

1 patent

SANYO ELECTRIC CO

1 patent

KOBAYASHI HIROSHI

1 patent

MINOLTA CAMERA KK

1 patent

NISSHA CO LTD

1 patent

YOSHIMURA SHOJI

1 patent

Showing the top 50 of 68 patents by PatentIndex Score.