Inventor
MIURA Daichi
JP2 patents
Patents
2 patentsUS10601147B2Mar 24, 2020
Method of bonding core wire and bonding object, ultrasonic bonding device, and junction between core wire and bonding object
SUMITOMO WIRING SYSTEMS2 citations69
US10971878B2Apr 6, 2021
Method for manufacturing terminal-equipped electrical wire, terminal-equipped electrical wire, and ultrasonic welding device
SUMITOMO WIRING SYSTEMS2 citations65