Inventor

KISH JR FRED A

US121 patents

⚠️ This page may combine multiple inventors who share the name “KISH JR FRED A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KISH JR FRED A

INFINERA CORP

Transmitter photonic integrated circuit (TxPIC) chips

Transmitter photonic integrated circuits (TxPIC) and optical transport networks employing TxPICs

Transmitter photonic integrated circuit (TxPIC) chip architectures and drive systems and wavelength stabilization for TxPICs

Method of in-wafer testing of monolithic photonic integrated circuits (PICs) formed in a semiconductor wafer

Monolithic transmitter photonic integrated circuit (TxPIC) having tunable modulated sources with feedback system for source power level or wavelength tuning

Forward error correction (FEC) enabled photonic integrated circuit (PICs) chips with multiple signal channels

Coolerless photonic integrated circuits (PICs) for WDM transmission networks and PICs operable with a floating signal channel grid changing with temperature but with fixed channel spacing in the floating grid

Probe card for testing in-wafer photonic integrated circuits (PICs) and method of use

Monolithic transmitter/receiver photonic integrated circuit (Tx/RxPIC) transceiver chip

Digital optical network architecture

Optical transmission network with a receiver photonic integrated circuit (RxPIC) utilizing an optical service chanel (OSC)

Monolithic photonic integrated circuit (PIC) CHIP

Method of optimizing optical channel signal demultiplexing in a monolithic receiver photonic integrated circuit (RxPIC)

Optical transmission network with transmitter photonic integrated circuit (TxPIC) utilizing an optical service channel (OSC)

Method and apparatus of monitoring and controlling the emission wavelengths of a plurality of laser sources integrated on the same chip or in the same photonic integrated circuit (PIC)

Optical signal receiver, an associated photonic integrated circuit (RxPIC), and method improving performance

FEC enhanced system for an optical communication network

Optical transmitter

Method of tuning integrated laser sources with integrated wavelength tuning elements on the same substrate or in a monolithic photonic integrated circuit (PIC)

Method and apparatus of monitoring and controlling the emission wavelengths of a plurality of laser sources integrated on the same chip or in the same photonic integrated circuit (PIC)

Optical probe and method of testing employing an interrogation beam or optical pickup

Optical transport network

Method of in-wafer testing of monolithic photonic integrated circuits (PICs) formed in a semiconductor wafer

In-wafer testing of integrated optical components in photonic integrated circuits (PICs)

Photonic integrated circuit (PIC) chips

LUMILEDS LIGHTING LLC

LED having angled sides for increased side light extraction

Forming LED having angled sides for increased side light extraction

Light extraction from a semiconductor light-emitting device via chip shaping

III-nitride light emitting devices fabricated by substrate removal

III-Nitride Light-emitting device with increased light generating capability

Method of making a III-nitride light-emitting device with increased light generating capability

III-nitride light-emitting device with increased light generating capability

Methods for fabricating light emitting devices having aluminum gallium indium nitride structures and mirror stacks

Light emitting devices having wafer bonded aluminum gallium indium nitride structures and mirror stacks

III-nitride light-emitting device with increased light generating capability

Electrode structures for light emitting devices

Thickness tailoring of wafer bonded AlxGayInzN structures by laser melting

Diffusion barrier for increased mirror reflectivity in reflective solderable contacts on high power led chip

Diffusion barrier for increased mirror reflectivity in reflective solderable contacts on high power LED chip

HEWLETT PACKARD CO

Transparent substrate light emitting diodes with directed light output

Highly reflective contacts for light emitting semiconductor devices

Transparent substrate light emitting diodes with directed light output

Ordered interface texturing for a light emitting device

Transparent substrate vertical cavity surface emitting lasers fabricated by semiconductor wafer bonding

Fabrication of transparent substrate vertical cavity surface emitting lasers by semiconductor wafer bonding

Method for bonding compound semiconductor wafers to create an ohmic interface

PHILIPS LUMILEDS LIGHTING CO

Light extraction from a semiconductor light emitting device via chip shaping

III-nitride light emitting devices fabricated by substrate removal

WELCH DAVID F

Transmitter photonic integrated circuit (TxPIC) chip

KISH JR FRED A

Method of tuning optical components integrated in a monolithic photonic integrated circuit (PIC)