Inventor
SUKAMTO JOHANES H
US3 patents
Patents
3 patentsUS7341946B2Mar 11, 2008
Methods for the electrochemical deposition of copper onto a barrier layer of a work piece
NOVELLUS SYSTEMS INC20 citations92
US7727863B1Jun 1, 2010
Sonic irradiation during wafer immersion
NOVELLUS SYSTEMS INC33 citations91
US7442267B1Oct 28, 2008
Anneal of ruthenium seed layer to improve copper plating
NOVELLUS SYSTEMS INC25 citations90