Inventor

KIM JIN SEONG

KR84 patents

⚠️ This page may combine multiple inventors who share the name “KIM JIN SEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM JIN SEONG

AMKOR TECHNOLOGY INC

Semiconductor package and manufacturing method thereof

Thin bonded interposer package

Fingerprint sensor and manufacturing method thereof

Image sensor package and method for manufacture thereof

Methods and structures for increasing the allowable die size in TMV packages

Fingerprint sensor and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Thin bonded interposer package

Manufacturing method of semiconductor device and semiconductor device manufactured thereby

Semiconductor devices and methods of making semiconductor devices

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

Semiconductor device having overlapped via apertures

Semiconductor device having overlapped via apertures

Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects

Semiconductor package structure for improving die warpage and manufacturing method thereof

Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

AMKOR TECH SINGAPORE HOLDING PTE LTD

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor device having EMI shielding structure and related methods

Semiconductor device having EMI shielding structure and related methods

Semiconductor devices and methods of manufacturing semiconductor devices

Semiconductor package structure for improving die warpage and manufacturing method thereof

Thin bonded interposer package

Semiconductor device having EMI shielding structure and related methods

Sensor package and manufacturing method thereof

Sensor package and manufacturing method thereof

Methods and structures for increasing the allowable die size in TMV packages

Sensor package and manufacturing method thereof

Semiconductor device with through-mold via

Semiconductor device and manufacturing method thereof

Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate

Semiconductor package and manufacturing method thereof

Semiconductor device with through-mold via

LG DISPLAY CO LTD

Touch display apparatus

Touch display apparatus

Touch display apparatus

Touch display apparatus

Touch display apparatus

Touch display apparatus

Touch display apparatus

LG INNOTEK CO LTD

Light emitting device and lighting system including the same

Light emitting device and lighting system having the same

Light emitting device and lighting system having the same

Light emitting device and lighting system including the same

KIM JIN SEONG

Semiconductor device and fabricating method thereof

Semiconductor device having overlapped via apertures

NICHOLLS LOUIS W

Methods and structures for increasing the allowable die size in TMV packages

KIM GWANG HO

Semiconductor device including increased capacity leadframe

SAMSUNG ELECTRO MECH

Inductor