Inventor

KUO KWEI-KUAN

CH3 patents

⚠️ This page may combine multiple inventors who share the name “KUO KWEI-KUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SLAVOV NEDYALKO

2 patents

US8125074B2Feb 28, 2012

Laminated substrate for an integrated circuit BGA package and printed circuit boards

SLAVOV NEDYALKO3 citations54

US8222722B2Jul 17, 2012

Integrated circuit package and device

SLAVOV NEDYALKO0 citations42

SUZHOU ASEN SEMICONDUCTORS CO LTD

1 patent

US9972561B2May 15, 2018

QFN package with grooved leads

SUZHOU ASEN SEMICONDUCTORS CO LTD0 citations24