Inventor
CHENG HSI-KUEI
TW47 patents
⚠️ This page may combine multiple inventors who share the name “CHENG HSI-KUEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
32 patentsUS9922896B1Mar 20, 2018
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US10529697B2Jan 7, 2020
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10290530B2May 14, 2019
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10128182B2Nov 13, 2018
Semiconductor package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10522526B2Dec 31, 2019
LTHC as charging barrier in InFO package formation
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10692809B2Jun 23, 2020
Manufacturing method for semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11437361B2Sep 6, 2022
LTHC as charging barrier in InFO package formation
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10573573B2Feb 25, 2020
Package and package-on-package structure having elliptical conductive columns
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10163843B2Dec 25, 2018
Semiconductor device structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10090267B2Oct 2, 2018
Bump structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US9997482B2Jun 12, 2018
Solder stud structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9806046B2Oct 31, 2017
Semiconductor device structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US9735123B2Aug 15, 2017
Semiconductor device structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US10546845B2Jan 28, 2020
Package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12334489B2Jun 17, 2025
Lthc as charging barrier in info package formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12261074B2Mar 25, 2025
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051634B2Jul 30, 2024
Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11990454B2May 21, 2024
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11984342B2May 14, 2024
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11948881B2Apr 2, 2024
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11923353B2Mar 5, 2024
LTHC as charging barrier in info package formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11756849B2Sep 12, 2023
Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11404341B2Aug 2, 2022
Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11217548B2Jan 4, 2022
Semiconductor device structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11145613B2Oct 12, 2021
Method for forming bump structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11069614B2Jul 20, 2021
Semiconductor package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10950478B2Mar 16, 2021
Info structure with copper pillar having reversed profile
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12046588B2Jul 23, 2024
Package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11257797B2Feb 22, 2022
Package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10290590B2May 14, 2019
Stacked semiconductor device and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US10867973B2Dec 15, 2020
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9779969B2Oct 3, 2017
Package structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41
TAIWAN SEMICONDUCTOR MFG
14 patentsUS9209048B2Dec 8, 2015
Two step molding grinding for packaging applications
TAIWAN SEMICONDUCTOR MFG19 citations92
US7030016B2Apr 18, 2006
Post ECP multi-step anneal/H2 treatment to reduce film impurity
TAIWAN SEMICONDUCTOR MFG22 citations92
US7432192B2Oct 7, 2008
Post ECP multi-step anneal/H2 treatment to reduce film impurity
TAIWAN SEMICONDUCTOR MFG11 citations83
US7026233B2Apr 11, 2006
Method for reducing defects in post passivation interconnect process
TAIWAN SEMICONDUCTOR MFG12 citations81
US6482290B1Nov 19, 2002
Sweeping slurry dispenser for chemical mechanical polishing
TAIWAN SEMICONDUCTOR MFG19 citations77
US6585826B2Jul 1, 2003
Semiconductor wafer cleaning method to remove residual contamination including metal nitride particles
TAIWAN SEMICONDUCTOR MFG10 citations71
US7256120B2Aug 14, 2007
Method to eliminate plating copper defect
TAIWAN SEMICONDUCTOR MFG8 citations70
US6863491B2Mar 8, 2005
Catch-pin water support for process chamber
TAIWAN SEMICONDUCTOR MFG4 citations59
US6695921B2Feb 24, 2004
Hoop support for semiconductor wafer
TAIWAN SEMICONDUCTOR MFG5 citations59
US7667835B2Feb 23, 2010
Apparatus and method for preventing copper peeling in ECP
TAIWAN SEMICONDUCTOR MFG0 citations51
US7262067B2Aug 28, 2007
Method for conductive film quality evaluation
TAIWAN SEMICONDUCTOR MFG1 citations51
US6985222B2Jan 10, 2006
Chamber leakage detection by measurement of reflectivity of oxidized thin film
TAIWAN SEMICONDUCTOR MFG0 citations51
US9391067B2Jul 12, 2016
Multiple silicide integration structure and method
TAIWAN SEMICONDUCTOR MFG0 citations49
US7528478B2May 5, 2009
Semiconductor devices having post passivation interconnections and a buffer layer
TAIWAN SEMICONDUCTOR MFG0 citations49