Inventor
LAI YI-JEN
TW35 patents
⚠️ This page may combine multiple inventors who share the name “LAI YI-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
28 patentsUS10510734B2Dec 17, 2019
Semiconductor packages having dummy connectors and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10276548B2Apr 30, 2019
Semiconductor packages having dummy connectors and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US10522526B2Dec 31, 2019
LTHC as charging barrier in InFO package formation
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations83
US10867976B2Dec 15, 2020
Semiconductor packages having dummy connectors and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11437361B2Sep 6, 2022
LTHC as charging barrier in InFO package formation
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10573573B2Feb 25, 2020
Package and package-on-package structure having elliptical conductive columns
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10163843B2Dec 25, 2018
Semiconductor device structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10090267B2Oct 2, 2018
Bump structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US9997482B2Jun 12, 2018
Solder stud structure
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations72
US9806046B2Oct 31, 2017
Semiconductor device structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US9735123B2Aug 15, 2017
Semiconductor device structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US10546845B2Jan 28, 2020
Package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12334489B2Jun 17, 2025
Lthc as charging barrier in info package formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051634B2Jul 30, 2024
Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11923353B2Mar 5, 2024
LTHC as charging barrier in info package formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11756849B2Sep 12, 2023
Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11404341B2Aug 2, 2022
Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11217548B2Jan 4, 2022
Semiconductor device structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11145613B2Oct 12, 2021
Method for forming bump structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12046588B2Jul 23, 2024
Package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11488891B2Nov 1, 2022
Method of forming conductive bumps for cooling device connection and semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11257797B2Feb 22, 2022
Package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10290590B2May 14, 2019
Stacked semiconductor device and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US9899296B2Feb 20, 2018
Method of forming conductive bumps for cooling device connection
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US11201142B2Dec 14, 2021
Semiconductor package, package on package structure and method of froming package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9594096B2Mar 14, 2017
Probe card for simultaneously testing multiple dies
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10651111B2May 12, 2020
Method of forming conductive bumps for cooling device connection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9779969B2Oct 3, 2017
Package structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41