Inventor

HSIEH CHENG-HSIEN

TW56 patents

⚠️ This page may combine multiple inventors who share the name “HSIEH CHENG-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSIEH CHENG-HSIEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package and method of forming the same

Dummy features in redistribution layers (RDLS) and methods of forming same

Redistribution layers in semiconductor packages and methods of forming same

Semiconductor device and method of manufacture

Dummy metal with zigzagged edges

Redistribution layers in semiconductor packages and methods of forming same

Redistribution layers in semiconductor packages and methods of forming same

3D packages and methods for forming the same

Opening in the pad for bonding integrated passive device in InFO package

Surface mount device/integrated passive device on package or device structure and methods of forming

Under bump metallurgy (UBM) and methods of forming same

Under bump metallurgy (UBM) and methods of forming same

Semiconductor device

Package structures and methods of forming the same

Integrated fan-out package, semiconductor device, and method of fabricating the same

Semiconductor package with redistribution structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

3D packages and methods for forming the same

Dummy features in redistribution layers (RDLS) and methods of forming same

Redistribution layers in semiconductor packages and methods of forming same

Semiconductor package and method of forming the same

3D packages and methods for forming the same

Conductive vias in semiconductor packages and methods of forming same

Dummy metal with zigzagged edges

Package structures and method of forming the same

Dummy features in redistribution layers (RDLS) and methods of forming same

Package structure and method for forming the same

Method of forming an integrated circuit package having a padding layer on a carrier

Semiconductor device and method of manufacture

3D packages and methods for forming the same

Semiconductor package and method of forming the same

Opening in the pad for bonding integrated passive device in InFO package

Opening in the pad for bonding integrated passive device in InFO package

Method for forming package structure

Opening in the pad for bonding integrated passive device in InFO package

Conductive vias in semiconductor packages and methods of forming same

Three-dimensional chip stack and method of forming the same

Semiconductor package with redistribution structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package with redistribution structure and manufacturing method thereof

Semiconductor package including shielding plate in redistribution structure, semiconductor package including conductive via in redistribution structure, and manufacturing method thereof

Dummy metal with zigzagged edges

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG

3D packages and methods for forming the same

Three-dimensional chip stack and method of forming the same

FKA DISTRIBUTING CO

Blood pressure monitor

Blood pressure monitor

NANYA TECHNOLOGY CORP

Semiconductor structure and method for preparing the same

Semiconductor structure

Cymer LLC

Optimization of source and bandwidth for new and existing patterning devices