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Inventor
JEON YOUNG WOON
KR
2 patents
Patents
2 patents
US9818913B2
Nov 14, 2017
Chip substrate
POINT ENGINEERING CO LTD
0 citations
42
US9595642B2
Mar 14, 2017
Chip substrate comprising a plated layer and chip package using the same
POINT ENGINEERING CO LTD
0 citations
42