Inventor
YUN KYOUNG JA
KR3 patents
Patents
3 patentsUS9818913B2Nov 14, 2017
Chip substrate
POINT ENGINEERING CO LTD0 citations42
US9595642B2Mar 14, 2017
Chip substrate comprising a plated layer and chip package using the same
POINT ENGINEERING CO LTD0 citations42
US9913381B2Mar 6, 2018
Base substrate which prevents burrs generated during the cutting process and method for manufacturing the same
POINT ENGINEERING CO LTD0 citations38