Inventor

LIU MENGBIN

CN18 patents

⚠️ This page may combine multiple inventors who share the name “LIU MENGBIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIU MENGBIN

NINGBO SEMICONDUCTOR INT CORP

Packaging method and package structure of wafer-level system-in-package

Methods and structures for wafer-level system in package

Image sensor module and method for forming the same

Image capturing assembly, lens module and electronic device

Package structure of wafer-level system-in-package

Alignment mark and semiconductor device, and fabrication methods thereof

Fingerprint identification module, method for forming fingerprint identification module, and electronic device

Air gap type semiconductor device package structure

Image capturing assembly and packaging method thereof, lens module and electronic device

Mask plate and fabrication method thereof

Image capturing assembly and packaging method thereof, lens module, and electronic device

Camera assembly and packaging method thereof, lens module, electronic device

Camera assembly and packaging method thereof, lens module, and electronic device

Camera assembly and packaging methods thereof, lens module, and electronic device

Packaging method and package structure of wafer-level system-in-package

Wafer-level system-in-package structure and electronic apparatus thereof

Wafer-level packaging methods using a photolithographic bonding material

NINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH

Air gap type semiconductor device package structure and fabrication method thereof