Inventor · disambiguated record
Theodorus Martinus Michielsen
Also filed as: MICHIELSEN THEODORUS · MICHIELSEN THEODORUS M · MICHIELSEN THEODORUS MARTINUS
14 granted patents·6 pending applications·503 citations·filing 1986–2014
92Inventor score
Top patents by PatentIndex Score
20 records- 0197US4983251AMethod of manufacturing semiconductor devicesPHILIPS CORP·Filed 1986·Granted Jan 8, 1991·294 cites·43 claims
- 0288US7736948B2Method of manufacturing a plurality of semiconductor devices and carrier substrateKONINKL PHILIPS ELECTRONICS NV·Filed 2006·Granted Jun 15, 2010·23 cites·10 claims
- 0388US6762510B2Flexible integrated monolithic circuitKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted Jul 13, 2004·69 cites·10 claims
- 0471US5028558AMethod of manufacturing a silicon on insulator semiconductorPHILIPS CORP·Filed 1989·Granted Jul 2, 1991·40 cites·6 claims
- 0562US8708922B2Electrically isolated catheter with wireless sensorsDEKKER RONALD·Filed 2007·Granted Apr 29, 2014·2 cites·22 claims
- 0662US7816774B2Flexible semiconductor device and identification labelKONINKL PHILIPS ELECTRONICS NV·Filed 2004·Granted Oct 19, 2010·7 cites·6 claims
- 0762US5009689AMethod of manufacturing a semiconductor devicePHILIPS CORP·Filed 1987·Granted Apr 23, 1991·29 cites·8 claims
- 0861US8067802B2Flexible device and method of manufacturing the sameDEKKER RONALD·Filed 2003·Granted Nov 29, 2011·6 cites·8 claims
- 0960US4971925AImproved method of manufacturing a semiconductor device of the "semiconductor on insulator" typePHILIPS CORP·Filed 1988·Granted Nov 20, 1990·31 cites·11 claims
- 1059US7845378B2Device for bonding two plate-shaped objectsKONINKL PHILIPS ELECTRONICS NV·Filed 2007·Granted Dec 7, 2010·0 cites·1 claims
- 1155US7271075B2Method and a device for bonding two plate-shaped objectsKONINKL PHILIPS ELECTRONICS NV·Filed 2003·Granted Sep 18, 2007·1 cites·6 claims
- 1248US2012038032A1Flexible device and method of manufacturing the sameDEKKER RONALD·Filed 2011·Application pending·0 cites
- 1346US8105873B2Flexible semiconductor device and identification labelDEKKER RONALD·Filed 2010·Granted Jan 31, 2012·0 cites·20 claims
- 1445US2010164079A1Method of manufacturing an assembly and assemblyKONINKL PHILIPS ELECTRONICS NV·Filed 2006·Application pending·0 cites
- 1543US6775350B2Method of examining a wafer of semiconductor material by means of X-raysKONINKL PHILIPS ELECTRONICS NV·Filed 2002·Granted Aug 10, 2004·1 cites·5 claims
- 1643US2009127702A1Package, subassembly and methods of manufacturing thereofKONINKL PHILIPS ELECTRONICS NV·Filed 2006·Application pending·0 cites
- 1742US2014194753A1Electrically isolated catheter with wireless sensorsKONINKL PHILIPS NV·Filed 2014·Application pending·0 cites
- 1838US2009283891A1Elastically deformable integrated-circuit deviceKONINKL PHILIPS ELECTRONICS NV·Filed 2007·Application pending·0 cites
- 1937US2006278976A1Semiconductor device, method and manufacturing same, identification label and information carrierKONINKL PHILIPS ELECTRONICS NV·Filed 2004·Application pending·0 cites
- 2030US5828122ASemiconductor body with a substrate glued to a support bodyPHILIPS CORP·Filed 1997·Granted Oct 27, 1998·0 cites·13 claims
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