Inventor

CHEN HSIANG-FU

TW43 patents

⚠️ This page may combine multiple inventors who share the name “CHEN HSIANG-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN HSIANG-FU

TAIWAN SEMICONDUCTOR MFG CO LTD

Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device

Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity

Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications

Microelectromechanical systems (MEMS) devices at different pressures

Semiconductor arrangement and formation thereof

MEMS device with enhanced sensing structure and manufacturing method thereof

Monolithic MEMS platform for integrated pressure, temperature, and gas sensor

Semiconductor arrangement and formation thereof

Semiconductor device and method of manufacturing

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

MEMS structure

Piezoelectric anti-stiction structure for microelectromechanical systems

Bonding structure and method thereof

Piezoelectric anti-stiction structure for microelectromechanical systems

Piezoelectric anti-stiction structure for microelectromechanical systems

MEMS device

Semiconductor arrangement and formation thereof

Bond wave optimization method and device

Bond wave optimization method and device

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformity

Method and system for detecting semiconductor device

MEMS structure with bilayer stopper and method for forming the same

Microelectromechanical systems (MEMS) devices at different pressures

Thin film structure for hermetic sealing

Semiconductor device and manufacturing method thereof

Dielectric protection layer configured to increase performance of mems device

Semiconductor device and method of manufacturing same

Micro-electromechanical systems (MEMS) device with outgas layer

Semiconductor device and method of manufacture

Semiconductor device comprising different types of microelectromechanical systems devices

Semiconductor device having microelectromechanical systems devices with improved cavity pressure uniformity

Semiconductor device comprising different types of microelectromechanical systems devices

Semiconductor device and manufacturing method

Method of selectively removing an anti-stiction layer on a eutectic bonding area

SHU CHIA-PAO

Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same

Structure and method for motion sensor

Hybrid MEMS bump design to prevent in-process and in-use stiction

TAIWAN SEMICONDUCTOR MFG

Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV)

Micro-electro mechanical system (MEMS) structures and methods of forming the same

HUNG CHIA-MING

Electrical bypass structure for MEMS device

LEE JIOU-KANG

Process for eliminating delamination between amorphous silicon layers