Inventor
SHEN CHING-KAI
TW17 patents
⚠️ This page may combine multiple inventors who share the name “SHEN CHING-KAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
16 patentsUS10266396B2Apr 23, 2019
MEMS device with enhanced sensing structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11772960B2Oct 3, 2023
Method of forming dielectric and metal sealing layers on capping structure of a MEMs device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US10961118B2Mar 30, 2021
Wafer level integrated MEMS device enabled by silicon pillar and smart cap
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10961114B2Mar 30, 2021
Semiconductor structure and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US10556792B2Feb 11, 2020
Wafer level integrated MEMS device enabled by silicon pillar and smart cap
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12577099B2Mar 17, 2026
Method for manufacturing semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12017908B2Jun 25, 2024
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11807520B2Nov 7, 2023
Semiconductor structure and method for manufacturing thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11276670B2Mar 15, 2022
Semiconductor device and manufacturing method of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11851318B2Dec 26, 2023
MEMS device and method for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10899608B2Jan 26, 2021
Wafer level integrated MEMS device enabled by silicon pillar and smart cap
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12202724B2Jan 21, 2025
Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent hole
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12074110B2Aug 27, 2024
Method for manufacturing semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11462478B2Oct 4, 2022
Layer for buffer semiconductor device including microelectromechnical system (MEMS) device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US9422151B1Aug 23, 2016
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US12441604B2Oct 14, 2025
Micro-electromechanical systems (MEMS) device with outgas layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50