P

Inventor

SHEN CHING-KAI

TW17 patents
⚠️ This page may combine multiple inventors who share the name “SHEN CHING-KAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

16 patents
US10266396B2Apr 23, 2019

MEMS device with enhanced sensing structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11772960B2Oct 3, 2023

Method of forming dielectric and metal sealing layers on capping structure of a MEMs device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US10961118B2Mar 30, 2021

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10961114B2Mar 30, 2021

Semiconductor structure and manufacturing method for the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US10556792B2Feb 11, 2020

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12577099B2Mar 17, 2026

Method for manufacturing semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12017908B2Jun 25, 2024

Semiconductor structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11807520B2Nov 7, 2023

Semiconductor structure and method for manufacturing thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11276670B2Mar 15, 2022

Semiconductor device and manufacturing method of semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11851318B2Dec 26, 2023

MEMS device and method for making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10899608B2Jan 26, 2021

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12202724B2Jan 21, 2025

Micro electro mechanical system (MEMs) device having metal sealing on necking portion of vent hole

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12074110B2Aug 27, 2024

Method for manufacturing semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11462478B2Oct 4, 2022

Layer for buffer semiconductor device including microelectromechnical system (MEMS) device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US9422151B1Aug 23, 2016

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US12441604B2Oct 14, 2025

Micro-electromechanical systems (MEMS) device with outgas layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50

SHEN CHING-KAI

1 patent