P

Inventor

HU FAN

TW34 patents
⚠️ This page may combine multiple inventors who share the name “HU FAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

20 patents
US10961118B2Mar 30, 2021

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10556792B2Feb 11, 2020

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12479719B2Nov 25, 2025

MEMS structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12215016B2Feb 4, 2025

Piezoelectric anti-stiction structure for microelectromechanical systems

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12015001B2Jun 18, 2024

Bonding structure and method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11984261B2May 14, 2024

Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11834325B2Dec 5, 2023

Piezoelectric anti-stiction structure for microelectromechanical systems

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11667522B2Jun 6, 2023

MEMS package comprising multi-depth trenches

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11365115B2Jun 21, 2022

Piezoelectric anti-stiction structure for microelectromechanical systems

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11220422B2Jan 11, 2022

MEMS device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11107630B2Aug 31, 2021

Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11289568B2Mar 29, 2022

Reduction of electric field enhanced moisture penetration by metal shielding

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10899608B2Jan 26, 2021

Wafer level integrated MEMS device enabled by silicon pillar and smart cap

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12362240B2Jul 15, 2025

Method and system for detecting semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56
US10865102B2Dec 15, 2020

Multi-depth MEMS package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10752495B2Aug 25, 2020

Method for forming multi-depth MEMS package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10618801B2Apr 14, 2020

MEMS structure with bilayer stopper and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10556790B2Feb 11, 2020

Method for forming multi-depth MEMS package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12269735B2Apr 8, 2025

Dielectric protection layer configured to increase performance of mems device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12441604B2Oct 14, 2025

Micro-electromechanical systems (MEMS) device with outgas layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50

OREAL

4 patents

WUHAN GOLDEN MINNA PHOTOELECTRIC SCI&TECH CO LTD

2 patents

SHANGHAI DELDELETE TOY CO LTD

2 patents

Hangzhou zhongmei huadong pharmaceutical co ltd

2 patents

WUHAN GOLDEN MINNA PHOTOELECTRIC SCI & TECH CO LTD

1 patent

TENCENT TECH SHENZHEN CO LTD

1 patent

SUZHOU SINOVENT PHARMACEUTICALS CO LTD

1 patent

CHONGQING ZONGSHEN GENERAL POWER MACHINE CO LTD

1 patent