Inventor
HU FAN
TW34 patents
⚠️ This page may combine multiple inventors who share the name “HU FAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
20 patentsUS10961118B2Mar 30, 2021
Wafer level integrated MEMS device enabled by silicon pillar and smart cap
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10556792B2Feb 11, 2020
Wafer level integrated MEMS device enabled by silicon pillar and smart cap
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12479719B2Nov 25, 2025
MEMS structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12215016B2Feb 4, 2025
Piezoelectric anti-stiction structure for microelectromechanical systems
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12015001B2Jun 18, 2024
Bonding structure and method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11984261B2May 14, 2024
Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11834325B2Dec 5, 2023
Piezoelectric anti-stiction structure for microelectromechanical systems
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11667522B2Jun 6, 2023
MEMS package comprising multi-depth trenches
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11365115B2Jun 21, 2022
Piezoelectric anti-stiction structure for microelectromechanical systems
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11220422B2Jan 11, 2022
MEMS device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11107630B2Aug 31, 2021
Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11289568B2Mar 29, 2022
Reduction of electric field enhanced moisture penetration by metal shielding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10899608B2Jan 26, 2021
Wafer level integrated MEMS device enabled by silicon pillar and smart cap
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12362240B2Jul 15, 2025
Method and system for detecting semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56
US10865102B2Dec 15, 2020
Multi-depth MEMS package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10752495B2Aug 25, 2020
Method for forming multi-depth MEMS package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10618801B2Apr 14, 2020
MEMS structure with bilayer stopper and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10556790B2Feb 11, 2020
Method for forming multi-depth MEMS package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12269735B2Apr 8, 2025
Dielectric protection layer configured to increase performance of mems device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12441604B2Oct 14, 2025
Micro-electromechanical systems (MEMS) device with outgas layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
OREAL
4 patentsUS12194122B2Jan 14, 2025
Combination of modified starch/C13-C15 fatty acid/clay
OREAL0 citations59
US10898420B2Jan 26, 2021
Compositions containing phenolic compounds having synergistic antioxidant benefits
OREAL0 citations56
US10828515B2Nov 10, 2020
Compositions containing phenolic compounds having synergistic antioxidant benefits
OREAL0 citations49
US12186418B2Jan 7, 2025
Foaming composition
OREAL0 citations46
WUHAN GOLDEN MINNA PHOTOELECTRIC SCI&TECH CO LTD
2 patentsSHANGHAI DELDELETE TOY CO LTD
2 patentsHangzhou zhongmei huadong pharmaceutical co ltd
2 patentsUS12459954B2Nov 4, 2025
Crystalline form a of GLP-1 receptor agonist and preparation method therefor
Hangzhou zhongmei huadong pharmaceutical co ltd0 citations51
US12421245B2Sep 23, 2025
Pharmaceutically acceptable acid salt of free base of GLP1 receptor agonist, and preparation method therefor
Hangzhou zhongmei huadong pharmaceutical co ltd0 citations51