P

Inventor

KIM RYAN RYOUNG HAN

BE40 patents
⚠️ This page may combine multiple inventors who share the name “KIM RYAN RYOUNG HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GLOBALFOUNDRIES INC

34 patents
US9412616B1Aug 9, 2016

Methods of forming single and double diffusion breaks on integrated circuit products comprised of FinFET devices and the resulting products

GLOBALFOUNDRIES INC148 citations99
US9362181B1Jun 7, 2016

Methods of forming diffusion breaks on integrated circuit products comprised of FinFET devices and the resulting products

GLOBALFOUNDRIES INC69 citations98
US9865704B2Jan 9, 2018

Single and double diffusion breaks on integrated circuit products comprised of FinFET devices

GLOBALFOUNDRIES INC41 citations94
US9490317B1Nov 8, 2016

Gate contact structure having gate contact layer

GLOBALFOUNDRIES INC29 citations94
US9711511B1Jul 18, 2017

Vertical channel transistor-based semiconductor memory structure

GLOBALFOUNDRIES INC30 citations93
US9478462B1Oct 25, 2016

SAV using selective SAQP/SADP

GLOBALFOUNDRIES INC31 citations92
US9484258B1Nov 1, 2016

Method for producing self-aligned vias

GLOBALFOUNDRIES INC21 citations91
US9209038B2Dec 8, 2015

Methods for fabricating integrated circuits using self-aligned quadruple patterning

GLOBALFOUNDRIES INC34 citations91
US9651855B2May 16, 2017

Methods for optical proximity correction in the design and fabrication of integrated circuits using extreme ultraviolet lithography

GLOBALFOUNDRIES INC7 citations84
US9553028B2Jan 24, 2017

Methods of forming reduced resistance local interconnect structures and the resulting devices

GLOBALFOUNDRIES INC14 citations84
US9379027B2Jun 28, 2016

Method of utilizing trench silicide in a gate cross-couple construct

GLOBALFOUNDRIES INC10 citations84
US9362403B2Jun 7, 2016

Buried fin contact structures on FinFET semiconductor devices

GLOBALFOUNDRIES INC6 citations84
US9202918B2Dec 1, 2015

Methods of forming stressed layers on FinFET semiconductor devices and the resulting devices

GLOBALFOUNDRIES INC13 citations84
US9153694B2Oct 6, 2015

Methods of forming contact structures on finfet semiconductor devices and the resulting devices

GLOBALFOUNDRIES INC10 citations84
US9595478B2Mar 14, 2017

Dummy gate used as interconnection and method of making the same

GLOBALFOUNDRIES INC6 citations82
US9171764B2Oct 27, 2015

Methods for fabricating integrated circuits using self-aligned quadruple patterning

GLOBALFOUNDRIES INC14 citations80
US10580779B2Mar 3, 2020

Vertical transistor static random access memory cell

GLOBALFOUNDRIES INC3 citations73
US10192792B2Jan 29, 2019

Method of utilizing trench silicide in a gate cross-couple construct

GLOBALFOUNDRIES INC1 citations73
US9953834B1Apr 24, 2018

Method of making self-aligned continuity cuts in mandrel and non-mandrel metal lines

GLOBALFOUNDRIES INC5 citations73
US9859120B1Jan 2, 2018

Method of making self-aligned continuity cuts in mandrel and non-mandrel metal lines

GLOBALFOUNDRIES INC4 citations73
US9543416B2Jan 10, 2017

Methods of forming products with FinFET semiconductor devices without removing fins in certain areas of the product

GLOBALFOUNDRIES INC2 citations73
US9406616B2Aug 2, 2016

Merged source/drain and gate contacts in SRAM bitcell

GLOBALFOUNDRIES INC5 citations73
US8796859B2Aug 5, 2014

Multilayer interconnect structure and method for integrated circuits

GLOBALFOUNDRIES INC4 citations73
US9209037B2Dec 8, 2015

Methods for fabricating integrated circuits including selectively forming and removing fin structures

GLOBALFOUNDRIES INC5 citations71
US9362279B1Jun 7, 2016

Contact formation for semiconductor device

GLOBALFOUNDRIES INC3 citations70
US9466604B2Oct 11, 2016

Metal segments as landing pads and local interconnects in an IC device

GLOBALFOUNDRIES INC2 citations63
US9299781B2Mar 29, 2016

Semiconductor devices with contact structures and a gate structure positioned in trenches formed in a layer of material

GLOBALFOUNDRIES INC2 citations63
US9171934B2Oct 27, 2015

Methods of forming semiconductor devices using a layer of material having a plurality of trenches formed therein

GLOBALFOUNDRIES INC2 citations63
US9449835B2Sep 20, 2016

Methods of forming features having differing pitch spacing and critical dimensions

GLOBALFOUNDRIES INC2 citations62
US10103066B2Oct 16, 2018

Method of utilizing trench silicide in a gate cross-couple construct

GLOBALFOUNDRIES INC0 citations52
US9431264B2Aug 30, 2016

Methods of forming integrated circuits and multiple critical dimension self-aligned double patterning processes

GLOBALFOUNDRIES INC1 citations51
US10283505B2May 7, 2019

Dummy gate used as interconnection and method of making the same

GLOBALFOUNDRIES INC0 citations50
US10153162B2Dec 11, 2018

Shrink process aware assist features

GLOBALFOUNDRIES INC1 citations48
US10050118B2Aug 14, 2018

Semiconductor device configured for avoiding electrical shorting

GLOBALFOUNDRIES INC1 citations48

IMEC VZW

5 patents

GLOBALFOUNDIES INC

1 patent