Inventor
KIM RYAN RYOUNG HAN
BE40 patents
⚠️ This page may combine multiple inventors who share the name “KIM RYAN RYOUNG HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
34 patentsUS9412616B1Aug 9, 2016
Methods of forming single and double diffusion breaks on integrated circuit products comprised of FinFET devices and the resulting products
GLOBALFOUNDRIES INC148 citations99
US9362181B1Jun 7, 2016
Methods of forming diffusion breaks on integrated circuit products comprised of FinFET devices and the resulting products
GLOBALFOUNDRIES INC69 citations98
US9865704B2Jan 9, 2018
Single and double diffusion breaks on integrated circuit products comprised of FinFET devices
GLOBALFOUNDRIES INC41 citations94
US9490317B1Nov 8, 2016
Gate contact structure having gate contact layer
GLOBALFOUNDRIES INC29 citations94
US9711511B1Jul 18, 2017
Vertical channel transistor-based semiconductor memory structure
GLOBALFOUNDRIES INC30 citations93
US9478462B1Oct 25, 2016
SAV using selective SAQP/SADP
GLOBALFOUNDRIES INC31 citations92
US9484258B1Nov 1, 2016
Method for producing self-aligned vias
GLOBALFOUNDRIES INC21 citations91
US9209038B2Dec 8, 2015
Methods for fabricating integrated circuits using self-aligned quadruple patterning
GLOBALFOUNDRIES INC34 citations91
US9651855B2May 16, 2017
Methods for optical proximity correction in the design and fabrication of integrated circuits using extreme ultraviolet lithography
GLOBALFOUNDRIES INC7 citations84
US9553028B2Jan 24, 2017
Methods of forming reduced resistance local interconnect structures and the resulting devices
GLOBALFOUNDRIES INC14 citations84
US9379027B2Jun 28, 2016
Method of utilizing trench silicide in a gate cross-couple construct
GLOBALFOUNDRIES INC10 citations84
US9362403B2Jun 7, 2016
Buried fin contact structures on FinFET semiconductor devices
GLOBALFOUNDRIES INC6 citations84
US9202918B2Dec 1, 2015
Methods of forming stressed layers on FinFET semiconductor devices and the resulting devices
GLOBALFOUNDRIES INC13 citations84
US9153694B2Oct 6, 2015
Methods of forming contact structures on finfet semiconductor devices and the resulting devices
GLOBALFOUNDRIES INC10 citations84
US9595478B2Mar 14, 2017
Dummy gate used as interconnection and method of making the same
GLOBALFOUNDRIES INC6 citations82
US9171764B2Oct 27, 2015
Methods for fabricating integrated circuits using self-aligned quadruple patterning
GLOBALFOUNDRIES INC14 citations80
US10580779B2Mar 3, 2020
Vertical transistor static random access memory cell
GLOBALFOUNDRIES INC3 citations73
US10192792B2Jan 29, 2019
Method of utilizing trench silicide in a gate cross-couple construct
GLOBALFOUNDRIES INC1 citations73
US9953834B1Apr 24, 2018
Method of making self-aligned continuity cuts in mandrel and non-mandrel metal lines
GLOBALFOUNDRIES INC5 citations73
US9859120B1Jan 2, 2018
Method of making self-aligned continuity cuts in mandrel and non-mandrel metal lines
GLOBALFOUNDRIES INC4 citations73
US9543416B2Jan 10, 2017
Methods of forming products with FinFET semiconductor devices without removing fins in certain areas of the product
GLOBALFOUNDRIES INC2 citations73
US9406616B2Aug 2, 2016
Merged source/drain and gate contacts in SRAM bitcell
GLOBALFOUNDRIES INC5 citations73
US8796859B2Aug 5, 2014
Multilayer interconnect structure and method for integrated circuits
GLOBALFOUNDRIES INC4 citations73
US9209037B2Dec 8, 2015
Methods for fabricating integrated circuits including selectively forming and removing fin structures
GLOBALFOUNDRIES INC5 citations71
US9362279B1Jun 7, 2016
Contact formation for semiconductor device
GLOBALFOUNDRIES INC3 citations70
US9466604B2Oct 11, 2016
Metal segments as landing pads and local interconnects in an IC device
GLOBALFOUNDRIES INC2 citations63
US9299781B2Mar 29, 2016
Semiconductor devices with contact structures and a gate structure positioned in trenches formed in a layer of material
GLOBALFOUNDRIES INC2 citations63
US9171934B2Oct 27, 2015
Methods of forming semiconductor devices using a layer of material having a plurality of trenches formed therein
GLOBALFOUNDRIES INC2 citations63
US9449835B2Sep 20, 2016
Methods of forming features having differing pitch spacing and critical dimensions
GLOBALFOUNDRIES INC2 citations62
US10103066B2Oct 16, 2018
Method of utilizing trench silicide in a gate cross-couple construct
GLOBALFOUNDRIES INC0 citations52
US9431264B2Aug 30, 2016
Methods of forming integrated circuits and multiple critical dimension self-aligned double patterning processes
GLOBALFOUNDRIES INC1 citations51
US10283505B2May 7, 2019
Dummy gate used as interconnection and method of making the same
GLOBALFOUNDRIES INC0 citations50
US10153162B2Dec 11, 2018
Shrink process aware assist features
GLOBALFOUNDRIES INC1 citations48
US10050118B2Aug 14, 2018
Semiconductor device configured for avoiding electrical shorting
GLOBALFOUNDRIES INC1 citations48
IMEC VZW
5 patentsUS10147637B2Dec 4, 2018
Methods for forming conductive paths and vias
IMEC VZW3 citations66
US10592632B2Mar 17, 2020
Method for analyzing design of an integrated circuit
IMEC VZW1 citations62
US11270912B2Mar 8, 2022
Method for forming a via hole self-aligned with a metal block on a substrate
IMEC VZW0 citations51
US11092884B2Aug 17, 2021
Mask for extreme-ultraviolet (extreme-UV) lithography and method for manufacturing the same
IMEC VZW0 citations51
US10978335B2Apr 13, 2021
Method for producing a gate cut structure on an array of semiconductor fins
IMEC VZW0 citations51