Inventor
CHEN PAO-TUNG
TW40 patents
⚠️ This page may combine multiple inventors who share the name “CHEN PAO-TUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
31 patentsUS9972603B2May 15, 2018
Seal-ring structure for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations93
US9806119B2Oct 31, 2017
3DIC seal ring structure and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9530811B2Dec 27, 2016
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10777539B2Sep 15, 2020
Seal-ring structure for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US11978758B2May 7, 2024
Methods and apparatus for via last through-vias
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11600653B2Mar 7, 2023
Methods and apparatus for via last through-vias
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11545443B2Jan 3, 2023
Method for forming hybrid-bonding structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10510792B2Dec 17, 2019
3DIC seal ring structure and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10475843B2Nov 12, 2019
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10269863B2Apr 23, 2019
Methods and apparatus for via last through-vias
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10062721B2Aug 28, 2018
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9634053B2Apr 25, 2017
Image sensor chip sidewall interconnection
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10867891B2Dec 15, 2020
Ion through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10475772B2Nov 12, 2019
Seal-ring structure for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10157895B2Dec 18, 2018
Seal-ring structure for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12396283B2Aug 19, 2025
3DIC seal ring structure and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11646247B2May 9, 2023
Ion through-substrate via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11552027B2Jan 10, 2023
Semiconductor packaging device comprising a shield structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11532661B2Dec 20, 2022
3DIC seal ring structure and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11037885B2Jun 15, 2021
Semiconductor packaging device comprising a shield structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10930699B2Feb 23, 2021
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10790240B2Sep 29, 2020
Metal line design for hybrid-bonding application
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10510791B2Dec 17, 2019
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10134794B2Nov 20, 2018
Image sensor chip sidewall interconnection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9929198B2Mar 27, 2018
Infrared image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9859322B2Jan 2, 2018
Methods and apparatus for glass removal in CMOS image sensors
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9780134B2Oct 3, 2017
Semiconductor device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9570503B2Feb 14, 2017
Ridge structure for back side illuminated image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9536915B2Jan 3, 2017
Image sensor with embedded infrared filter layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9374538B2Jun 21, 2016
Image sensor with embedded infrared filter layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9673246B2Jun 6, 2017
Dual metal for a backside package of backside illuminated image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
TAIWAN SEMICONDUCTOR MFG
6 patentsUS9337235B2May 10, 2016
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG227 citations99
US8878325B2Nov 4, 2014
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG12 citations92
US9123617B2Sep 1, 2015
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG4 citations84
US8946784B2Feb 3, 2015
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG8 citations84
US7968424B2Jun 28, 2011
Method of implantation
TAIWAN SEMICONDUCTOR MFG11 citations84
US9287310B2Mar 15, 2016
Methods and apparatus for glass removal in CMOS image sensors
TAIWAN SEMICONDUCTOR MFG3 citations73