Inventor

CHU YI-SHIN

TW44 patents

⚠️ This page may combine multiple inventors who share the name “CHU YI-SHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHU YI-SHIN

TAIWAN SEMICONDUCTOR MFG CO LTD

Seal-ring structure for stacking integrated circuits

Antenna effect protection and electrostatic discharge protection for three-dimensional integrated circuit

Elevated photodiode with a stacked scheme

Seal-ring structure for stacking integrated circuits

Semiconductor device including germanium region disposed in semiconductor substrate

Oversized via as through-substrate-via (TSV) stop layer

Oversized via as through-substrate-via (TSV) stop layer

Elevated photodiode with a stacked scheme

Semiconductor sensor and methods thereof

Germanium-based sensor with junction-gate field effect transistor and method of fabricating thereof

Antenna effect protection and electrostatic discharge protection for three-dimensional integrated circuit

Seal-ring structure for stacking integrated circuits

Seal-ring structure for stacking integrated circuits

Semiconductor image sensor and method for forming the same

Semiconductor structure and manufacturing method for the same

Passivation layer for epitaxial semiconductor process

Oversized via as through-substrate-via (TSV) stop layer

Image sensor with passivation layer for dark current reduction

Germanium-based sensor with junction-gate field effect transistor and method of fabricating thereof

Method of manufacturing an optical sensor

Passivation layer for epitaxial semiconductor process

Image sensor with passivation layer for dark current reduction

Germanium-based sensor with junction-gate field effect transistor and method of fabricating thereof

Semiconductor packaging device comprising a shield structure

Passivation layer for epitaxial semiconductor process

Semiconductor packaging device comprising a shield structure

Antenna effect protection and electrostatic discharge protection for three-dimensional integrated circuit

Backside contact to improve thermal dissipation away from semiconductor devices

Image sensor and manufacturing method thereof

Backside contact to improve thermal dissipation away from semiconductor devices

Backside contact to improve thermal dissipation away from semiconductor devices

Semiconductor structure and manufacturing method for the same

Elevated photodiode with a stacked scheme

Semiconductor structure and manufacturing method for the same

Vertically stacked light sensors

TAIWAN SEMICONDUCTOR MFG

Elevated photodiode with a stacked scheme

Elevated photodiode with a stacked scheme

Strap-contact scheme for compact array of memory cells

Elevated photodiodes with crosstalk isolation

Elevated photodiodes with crosstalk isolation

Gated semiconductor device and method of fabricating same

WANG SHIH WEI

Method for reducing topography of non-volatile memory and resulting memory cells

LIU SHIH-CHANG

Gated semiconductor device and method of fabricating same

SU CHING-CHUNG

Method for forming CMOS image sensors