P

Inventor

SUNG FU-TING

TW63 patents
⚠️ This page may combine multiple inventors who share the name “SUNG FU-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

42 patents
US9543511B2Jan 10, 2017

RRAM device

TAIWAN SEMICONDUCTOR MFG CO LTD22 citations94
US9209392B1Dec 8, 2015

RRAM cell with bottom electrode

TAIWAN SEMICONDUCTOR MFG CO LTD33 citations94
US9711713B1Jul 18, 2017

Semiconductor structure, electrode structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD14 citations93
US9178144B1Nov 3, 2015

RRAM cell with bottom electrode

TAIWAN SEMICONDUCTOR MFG CO LTD25 citations93
US10454021B2Oct 22, 2019

Semiconductor structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations92
US9196825B2Nov 24, 2015

Reversed stack MTJ

TAIWAN SEMICONDUCTOR MFG CO LTD13 citations92
US10529916B2Jan 7, 2020

Reversed stack MTJ

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10510952B2Dec 17, 2019

Storage device with composite spacer and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US10164184B2Dec 25, 2018

Resistance variable memory structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US10158069B2Dec 18, 2018

Memory cell having resistance variable film and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9837605B2Dec 5, 2017

Memory cell having resistance variable film and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9806254B2Oct 31, 2017

Storage device with composite spacer and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9614145B2Apr 4, 2017

Reversed stack MTJ

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11800822B2Oct 24, 2023

Memory device with composite spacer

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11581484B2Feb 14, 2023

Semiconductor structure, electrode structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11342379B2May 24, 2022

Trench formation scheme for programmable metallization cell to prevent metal redeposit

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11227993B2Jan 18, 2022

Device with composite spacer and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11050021B2Jun 29, 2021

Method for manufacturing resistive random access memory structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10720568B2Jul 21, 2020

Semiconductor structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10516107B2Dec 24, 2019

Memory cell having resistance variable film and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10468587B2Nov 5, 2019

Semiconductor structure, electrode structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9876169B2Jan 23, 2018

RRAM devices and methods

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9564448B2Feb 7, 2017

Flash memory structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12245528B2Mar 4, 2025

Memory device with composite spacer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12225829B2Feb 11, 2025

Semiconductor structure, electrode structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12218005B2Feb 4, 2025

Integrated circuit device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11114610B2Sep 7, 2021

Semiconductor structure, electrode structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11018299B2May 25, 2021

Memory cell having resistance variable film and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10957852B2Mar 23, 2021

Resistance variable memory structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10475998B2Nov 12, 2019

Resistive random access memory structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12354695B2Jul 8, 2025

Trench formation scheme for programmable metallization cell to prevent metal redeposit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12161057B2Dec 3, 2024

Method for forming semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11950523B2Apr 2, 2024

Memory device, memory integrated circuit and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11894267B2Feb 6, 2024

Method for fabricating integrated circuit device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11785786B2Oct 10, 2023

Trench formation scheme for programmable metallization cell to prevent metal redeposit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11785861B2Oct 10, 2023

Semiconductor structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11637240B2Apr 25, 2023

Semiconductor structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11417839B2Aug 16, 2022

Memory device, memory integrated circuit and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11362265B2Jun 14, 2022

Semiconductor structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11258007B2Feb 22, 2022

Reversed stack MTJ

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12302764B2May 13, 2025

In-situ formation of a spacer layer for protecting sidewalls of a phase change memory element and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12588429B2Mar 24, 2026

Resistive memory device including a silicon oxide base spacer and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60

TAIWAN SEMICONDUCTOR MFG

6 patents

HUANG WEI-HANG

2 patents

Showing the top 50 of 63 patents by PatentIndex Score.