Inventor
SUNG FU-TING
TW63 patents
⚠️ This page may combine multiple inventors who share the name “SUNG FU-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
42 patentsUS9543511B2Jan 10, 2017
RRAM device
TAIWAN SEMICONDUCTOR MFG CO LTD22 citations94
US9209392B1Dec 8, 2015
RRAM cell with bottom electrode
TAIWAN SEMICONDUCTOR MFG CO LTD33 citations94
US9711713B1Jul 18, 2017
Semiconductor structure, electrode structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations93
US9178144B1Nov 3, 2015
RRAM cell with bottom electrode
TAIWAN SEMICONDUCTOR MFG CO LTD25 citations93
US10454021B2Oct 22, 2019
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations92
US9196825B2Nov 24, 2015
Reversed stack MTJ
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations92
US10529916B2Jan 7, 2020
Reversed stack MTJ
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10510952B2Dec 17, 2019
Storage device with composite spacer and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US10164184B2Dec 25, 2018
Resistance variable memory structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US10158069B2Dec 18, 2018
Memory cell having resistance variable film and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9837605B2Dec 5, 2017
Memory cell having resistance variable film and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9806254B2Oct 31, 2017
Storage device with composite spacer and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9614145B2Apr 4, 2017
Reversed stack MTJ
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11800822B2Oct 24, 2023
Memory device with composite spacer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11581484B2Feb 14, 2023
Semiconductor structure, electrode structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11342379B2May 24, 2022
Trench formation scheme for programmable metallization cell to prevent metal redeposit
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11227993B2Jan 18, 2022
Device with composite spacer and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11050021B2Jun 29, 2021
Method for manufacturing resistive random access memory structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10720568B2Jul 21, 2020
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10516107B2Dec 24, 2019
Memory cell having resistance variable film and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10468587B2Nov 5, 2019
Semiconductor structure, electrode structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9876169B2Jan 23, 2018
RRAM devices and methods
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9564448B2Feb 7, 2017
Flash memory structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12245528B2Mar 4, 2025
Memory device with composite spacer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12225829B2Feb 11, 2025
Semiconductor structure, electrode structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12218005B2Feb 4, 2025
Integrated circuit device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11114610B2Sep 7, 2021
Semiconductor structure, electrode structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11018299B2May 25, 2021
Memory cell having resistance variable film and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10957852B2Mar 23, 2021
Resistance variable memory structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10475998B2Nov 12, 2019
Resistive random access memory structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12354695B2Jul 8, 2025
Trench formation scheme for programmable metallization cell to prevent metal redeposit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12161057B2Dec 3, 2024
Method for forming semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11950523B2Apr 2, 2024
Memory device, memory integrated circuit and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11894267B2Feb 6, 2024
Method for fabricating integrated circuit device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11785786B2Oct 10, 2023
Trench formation scheme for programmable metallization cell to prevent metal redeposit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11785861B2Oct 10, 2023
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11637240B2Apr 25, 2023
Semiconductor structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11417839B2Aug 16, 2022
Memory device, memory integrated circuit and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11362265B2Jun 14, 2022
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11258007B2Feb 22, 2022
Reversed stack MTJ
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12302764B2May 13, 2025
In-situ formation of a spacer layer for protecting sidewalls of a phase change memory element and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12588429B2Mar 24, 2026
Resistive memory device including a silicon oxide base spacer and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
TAIWAN SEMICONDUCTOR MFG
6 patentsUS8872149B1Oct 28, 2014
RRAM structure and process using composite spacer
TAIWAN SEMICONDUCTOR MFG61 citations98
US9040951B2May 26, 2015
Resistance variable memory structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG13 citations93
US9356231B2May 31, 2016
MRAM device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG3 citations73
US9306158B2Apr 5, 2016
MRAM device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG3 citations73
US9172033B2Oct 27, 2015
MRAM device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG4 citations73
US8822237B2Sep 2, 2014
Hole first hardmask definition
TAIWAN SEMICONDUCTOR MFG1 citations63
HUANG WEI-HANG
2 patentsShowing the top 50 of 63 patents by PatentIndex Score.