Inventor
TANIKELLA RAVINDRA V
US8 patents
⚠️ This page may combine multiple inventors who share the name “TANIKELLA RAVINDRA V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
6 patentsUS7335608B2Feb 26, 2008
Materials, structures and methods for microelectronic packaging
INTEL CORP8 citations71
US10211143B2Feb 19, 2019
Semiconductor device having polyimide layer
INTEL CORP2 citations70
US7816487B2Oct 19, 2010
Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same
INTEL CORP4 citations61
US9484277B2Nov 1, 2016
Materials, structures and methods for microelectronic packaging
INTEL CORP1 citations60
US11291122B2Mar 29, 2022
Apparatus with a substrate provided with plasma treatment
INTEL CORP0 citations58
US9147603B2Sep 29, 2015
Polymer grafting for enhanced dielectric and interconnect material adhesion
INTEL CORP1 citations48