P

Inventor

HOU LIN

BE26 patents
⚠️ This page may combine multiple inventors who share the name “HOU LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SANDISK TECHNOLOGIES LLC

10 patents
US11562975B2Jan 24, 2023

Bonded assembly employing metal-semiconductor bonding and metal-metal bonding and methods of forming the same

SANDISK TECHNOLOGIES LLC8 citations86
US11348901B1May 31, 2022

Interfacial tilt-resistant bonded assembly and methods for forming the same

SANDISK TECHNOLOGIES LLC8 citations85
US11869877B2Jan 9, 2024

Bonded assembly including inter-die via structures and methods for making the same

SANDISK TECHNOLOGIES LLC3 citations74
US11948902B2Apr 2, 2024

Bonded assembly including an airgap containing bonding-level dielectric layer and methods of forming the same

SANDISK TECHNOLOGIES LLC2 citations73
US11646283B2May 9, 2023

Bonded assembly containing low dielectric constant bonding dielectric material

SANDISK TECHNOLOGIES LLC2 citations73
US11424215B2Aug 23, 2022

Bonded assembly formed by hybrid wafer bonding using selectively deposited metal liners

SANDISK TECHNOLOGIES LLC3 citations73
US12125814B2Oct 22, 2024

Bonded assembly containing different size opposing bonding pads and methods of forming the same

SANDISK TECHNOLOGIES LLC0 citations62
US12347804B2Jul 1, 2025

Bonded assembly including interconnect-level bonding pads and methods of forming the same

SANDISK TECHNOLOGIES LLC0 citations52
US11646282B2May 9, 2023

Bonded semiconductor die assembly with metal alloy bonding pads and methods of forming the same

SANDISK TECHNOLOGIES LLC0 citations52
US12412854B2Sep 9, 2025

Semiconductor devices containing copper bonding pads with different conductive barrier layers and methods for forming the same

SANDISK TECHNOLOGIES LLC0 citations46

ORDOS YUANSHENG OPTOELECTRONICS CO LTD

9 patents

ZYNGA INC

1 patent

QINGDAO HAIER WASHING MACH CO

1 patent

CAO JINMING

1 patent

BOE TECHNOLOGY GROUP CO LTD

1 patent

INVENTEC PUDONG TECH CORP

1 patent

INTELLIGENT INTER CONNECTION TECH CO LTD

1 patent

IMEC VZW

1 patent