Inventor
DERAKHSHANDEH JABER
BE4 patents
Patents
4 patentsUS9978710B2May 22, 2018
Method for self-aligned solder reflow bonding and devices obtained thereof
IMEC VZW13 citations80
US10066303B2Sep 4, 2018
Thin NiB or CoB capping layer for non-noble metallic bonding landing pads
IMEC VZW0 citations48
US11810892B2Nov 7, 2023
Method of direct bonding semiconductor components
IMEC VZW0 citations46
US11362061B2Jun 14, 2022
Method for the electrical bonding of semiconductor components
IMEC VZW0 citations46