Inventor

CHEN NENG-KUO

TW77 patents

⚠️ This page may combine multiple inventors who share the name “CHEN NENG-KUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN NENG-KUO

TAIWAN SEMICONDUCTOR MFG CO LTD

Wrap-around contact

Wrap-around contact on FinFET

Wrap-around contact on FinFET

Wrap-around contact on FinFET

Slurry composition for chemical mechanical polishing of GE-based materials and devices

Slurry composition for chemical mechanical polishing of Ge-based materials and devices

Chemical mechanical polishing method using slurry composition containing N-oxide compound

Fin structure of FinFET

FinFETs with nitride liners and methods of forming the same

Method of forming the gate electrode of field effect transistor

Method for removing hard mask oxide and making gate structure of semiconductor devices

Inter-level connection for multi-layer structures

Inter-level connection for multi-layer structures

Fin structure of FinFET

Fin structure of FinFet

Wrap-around contact on FinFET

Wrap-around contact on FinFET

System for chemical mechanical polishing of Ge-based materials and devices

UNITED MICROELECTRONICS CORP

Method of manufacturing metal oxide semiconductor

Seamless trench fill method utilizing sub-atmospheric pressure chemical vapor deposition technique

Metal-oxide-semiconductor transistor and method of forming the same

Method for forming shallow trench isolation structure

Method for fabricating ultra-high tensile-stressed film and strained-silicon transistors thereof

Method for forming semiconductor device

Method of forming contact

Method of forming metal-oxide-semiconductor transistors

STI of a semiconductor device and fabrication method thereof

Metal-oxide-semiconductor transistor and method of forming the same

Method for forming a gate and etching a conductive layer

TAIWAN SEMICONDUCTOR MFG

Fin structure of FinFET

STI film property using SOD post-treatment

Non-uniformity reduction in semiconductor planarization

Method of reducing delamination in the fabrication of small-pitch devices

Self-aligned dual-metal silicide and germanide formation

Self aligned contact formation

Method of making a FinFET device

Non-uniformity reduction in semiconductor planarization

Shallow trench isolation corner rounding

CHEN NENG-KUO

Hybrid STI gap-filling approach

Gate electrode of field effect transistor

Method for forming interconnect structures

Hybrid gap-fill approach for STI formation

Selective etch-back process for semiconductor devices

Hybrid gap-fill approach for STI formation

HUANG GIN-CHEN

Fin field effect transistor gate oxide

Semiconductor device manufacturing methods and methods of forming insulating material layers

LAI CHIH-YU

Method of reducing delamination in the fabrication of small-pitch devices

CHANG CHUN-WEI

Method of protecting an interlayer dielectric layer and structure formed thereby

WINBOND ELECTRONICS CORP

Plug structure having low contact resistance and method of manufacturing

UNITED MICROELECTRIC CORP

Silicon oxide gap-filling process